The RF & Smart Sensor Systems (R3S) department at Fraunhofer IZM focuses on research and development services for wireless sensor nodes, radar sensor technology, and the technology-driven design of hardware for wireless communication and high-performance computing (HPC) modules.

R3S services cover the entire process of electronic systems development from feasibility studies to prototype manufacturing. In addition, the R3S team characterizes materials and technologies for packaging and interconnection (electronic packaging), creates integration concepts using the latest packaging technologies, and develops innovative designs for RF/high-speed, millimeter-wave, and terahertz packaging with special attention to signal and power integrity.