Tuesday, 10.3.2026 | Exhibitor's Forum, Hall 3 | Booth 3-611, 13:30 – 14:30

c-level@embedded world

embedded world Exhibition&Conference is the world’s largest event on the topic as well as the meeting point for the global community, from deeply technical developers to industry leaders. In the expert panel “c-level@embedded-world”, we will have top-level technology managers from leading companies discussing general trends, overarching challenges and looming opportunities of the embedded world. Join us for an intense discussion with today’s thought leaders!

Host:
Prof. Dr.-Ing. Axel Sikora, Offenburg University, Germany / Chairman of the embedded world Conference

Participants:

• Kirk Saban, Corp. VP Embedded Products, Software & Solutions, Advanced Micro Devices (AMD)
• Joe Fabbre, Vice President Global Technology, Green Hills Software
• Esam Elashmawi, Chief Strategy and Marketing Officer, Lattice Semiconductor
• Vijay Rentala, Technical Fellow and CTO, onsemi

Wednesday, 11.3.2026 | Exhibitor's Forum, Hall 5 | Booth 5-210, 11:30 – 12:30

Is RISC-V Ready for Automotive? Is Automotive Ready for RISC-V?

The RISC-V ISA has been rapidly gaining momentum. This momentum has resulted in processor shipments of nearly 2.5 billion RISC-V cores per year, driven by embedded, IoT, microcontroller and AI accelerator market segments. As an open standard, its modularity and flexibility enable domain specific processors, accelerators, chiplets, and SoCs to be developed directly for the target application. However, the automotive market demands much more in terms of technical and ecosystem maturity. Is RISC-V ready to meet those requirements? Automotive SoC architectures are currently in a state of flux, due to the end of life of old processor architectures, ECU consolidation, expanding infotainment use cases, AV/ADAS requirements including AI and V2X communications, and security requirements. RISC-V is gaining traction because of its ability to satisfy technical requirements for all the use cases, and because as an open architecture it can satisfy business requirements. Is the automotive industry ready to embrace RISC-V? This panel session brings together processor IP vendors, ecosystem providers, and SoC developers to discuss current status, roadmap, obstacles, next steps for RISC-V and automotive.

Host:
Andrea Gallo, CEO RISC-V International

Participants:

• Ozgur Ozkurt, CTO, Quintauris
• Thomas Schneid, Senior Director Software, Partnership & Ecosystem Management, Infineon Technologies
• Richard York, Dir. Prod. Mktg., Automotive and Embedded, SiFive
• Henrique Mendes, Product Engineer, Tessent Embedded Analytics, Siemens EDA

Wednesday, 11.3.2026 | Exhibitor's Forum, Hall 3 | Booth 3-611, 13:30 – 14:30

Navigating the EU Cyber Resilience Act: From Policy to Practice

The EU's Cyber Resilience Act (CRA) is a major regulatory shift for manufacturers of products with digital elements, especially those in the embedded devices and components sectors. This panel will delve into the CRA's practical impact, moving from the legislative text to the tangible challenges facing the industry. The core principle of the CRA is "secure-by-design," meaning cybersecurity must be built into products from their inception and managed throughout their entire lifecycle. Our expert panelists from legislation, standards, and industry, will provide a comprehensive look at the CRA's key obligations. These include mandatory vulnerability handling, the creation of a Software Bill of Materials (SBOM), and the essential requirements needed to obtain CE marking. We'll address the most pressing hurdles for companies, such as the financial costs of revamping development processes, the complexities of ensuring compliance across a fragmented global supply chain, and the struggle to balance rapid innovation with strict security requirements. The discussion will also focus on practical solutions and best practices. We'll explore how common European standards can offer a clear path to compliance and how companies can use existing frameworks to minimize disruption. This session is crucial for anyone involved in the creation or distribution of connected devices in the EU single market, providing a roadmap to navigate this new landscape and build a more resilient digital future.

Host:
Preeti Ohri Khemani, Senior Director CSS SRI, Infineon Technologies

Participants:

• Tommaso Bernabò, EU Commission - DG CONNECT
• Anna Schwendicke, BSI - The Federal Office for Information Security (Germany)
• Uwe Rüddenklau, CENELEC Technical Committee TC47X

Thursday, 12.3.2026 | Exhibitor's Forum, Hall 5 | Booth 5-210, 11:30 – 12:30

Emerging Cybersecurity Strategies for Software-Defined Vehicles: From Hardware Roots to AI Intrusion Detection

The complex nature of modern software-defined vehicles creates an extensive attack surface because of their intricate design and multiple connected systems, which need innovative advanced cybersecurity solutions for protection. The panel examines contemporary security approaches, which include hardware root-of-trust systems and secure boot protocols, and AI-powered intrusion detection systems for SDVs. The panel discusses methods to protect over-the-air updates, manage supply chain risks, secure V2X communication, and safeguard sensor systems against adversarial AI attacks. The fast adoption of connected systems and autonomous capabilities and cloud-based features creates multiple entry points for attackers, which requires organizations to implement multi-layered security systems. The discussion covers three essential security aspects, which include secure lifecycle management, zero-day vulnerability resistance, and AI-based continuous monitoring analytics. The panel will present examples of cyber incidents in the automotive sector to demonstrate the importance of developing preventive security measures, demonstrate how regulatory standards evolve, and demonstrate the necessary steps for companies to establish secure software-defined mobility systems and develop best practices for development.

Host:
Nicholas Glewicz, Vice President Judge Group

Participants:

• Lars Reger, EVP and CTO, NXP Semiconductors
• Suraj Gajendra, VP Products & Software Solutions Automotive, ARM
• Kanishk Agrawal, CTO, Judge Group India
• Amir Mahadi, Solution Manager Technical, Aumovio
• David Fritz, VP of Hybrid Physical & Virtual Systems, Siemens

Thursday, 12.3.2026 | Exhibitor's Forum, Hall 3 | Booth 3-611, 13:30 – 14:30

Embedded Vision on the Rise: How New Hardware Design and Physical AI are Pushing Boundaries

Embedded vision is entering a new era — one defined by powerful chip architectures, accelerating AI at the edge, and a wave of innovation that is reshaping robotics, automation, and intelligent devices. The panel discussion will explore how GPUs, NPUs, and next-generation hardware platforms are transforming real-time perception in the field. From ultra-efficient edge processing to “physical AI,” the discussion will dive into the design trade-offs behind power efficiency, footprint, and performance — and how these choices determine what’s possible in embedded vision today. Are cameras and sensors becoming secondary as compute capabilities explode, or does hardware matter more than ever? How can companies meet the massive performance demands of modern embedded vision applications while staying cost-effective and future-ready? We’ll examine how AI-driven embedded vision is accelerating progress across sectors such as automotive, manufacturing, and healthcare, paving the way for increasingly autonomous systems. The panel will also look into new applications and discuss the biggest hurdles that still need to be overcome, and the breakthroughs expected in the next 3 to 5 years. Join us for an insightful conversation about the rapidly evolving embedded vision landscape—and how the convergence of hardware innovation and physical AI is opening the door to the next generation of intelligent machines.

Host:
Anne Wendel, VDMA Robotics + Automation

Participants:

• John Healy, VP GM Industrial and Robotics Division, Intel
• Dr. Olaf Munkelt, CEO, MVTec Software
• Dr. Frederik Schönebeck, Director Product & Technology, FRAMOS
• Henning Tiarks, Chief Product Officer, Allied Vision