embedded award 2024: And the winners are
4/9/2024 Event Expert knowledge embedded world

embedded award 2024: And the winners are

For the 20th time, outstanding innovations from the field of embedded system technologies have been honoured with the embedded award at the embedded world Exhibition&Conference. “It is fascinating to see how innovations are being successfully driven forward across all disciplines in the embedded systems world”, emphasizes jury chairman Prof. Axel Sikora. We present the winners in the eight categories …

The winners of the embedded award 2024 The winners of the embedded award 2024

The winners of the embedded award


Artificial Intelligence


Exhibitor: Voltai
Hall/Booth: 3A/3A-335

“Read the Freaking manual” – this is a term every engineer in the electronics industry is familiar with. Engineers today are swimming in an ocean of documents. An average microcontroller has 10,000 – 50,000 pages of documents. This is just one chip, an engineer should integrate multiple of these chips to build a system – just 10x the documents they need to handle. Let alone the fact that these documents are written and read by non native English speakers riddled with mistakes. On the other hand, semiconductor companies have to hire hundreds of support engineers (FAEs) to support their customers.

Even with this, they can only support the top 5-10% of their customer base. Semiconductor companies are losing business and unable to support their long tail customers. If an engineer reaches out for support, they would need hours if not days to respond to an answer which is mostly along the lines of “Read the user manual”.

The entire hardware industry’s development speed is capped by how fast the engineers can read thousands of pages of PDFs. This is the sad state of our industry. This is the problem we’re after! 

We have built foundation models like GPT specialized on electronics and semiconductors. Our models cannot write poetry Models trained for hard-core engineering tasks, not for writing emails or poems. Our models today can, Help engineers answer questions they have about a chip – no more scrolling thousands of pages Write firmware code Help select the best part for their project Point out errors and help debug their firmware We support multiple languages, show sources for every answer we product, have 0 hallucinations.

Our model ingests a wide range of resources, including user manuals, architecture manuals, datasheets, errata sheets, forum discussions, internal databases and code samples, circuit diagrams, etc. Through extensive training on this data, we create an AI model proficient in electronics and well-versed in the intricacies of specific chips. Started less than 2 years ago, Voltai is answering questions of engineers behind the hood at some of the top semiconductor companies of the world.



Apollo510 MCU


Apollo510 MCU

Exhibitor: Ambiq
Hall/Booth: 3/3-301


AI has been restricted to the Cloud as it requires huge volumes of data, compute, and performance for its intensive calculations. There are tremendous benefits in offering AI on devices for consumers to use 24/7, such as gaining insights into their health via their smartwatches or asking their virtual assistants on smart speakers for help. Factories and agriculture industries can leverage smart devices like motion detectors and location trackers to help drive efficiency and productivity.

How to enable AI on everything and everywhere has been Ambiq's mission for the last 14 years. In a highly competitive semiconductor industry, Ambiq has carved out a unique existence in delivering truly ultra-low power microprocessors with unprecedented energy efficiency and compute performance that drive the latest endpoint devices, including digital health devices, factory automation, agriculture, smart homes, and 75% of the global wearable products.

Reducing cloud dependence has four major benefits for AI on endpoint devices: power savings, privacy protection, latency reduction, and increased robustness. These benefits offer immense value for manufacturers and consumers, and the debut of Ambiq’s Apollo510 MCU is set to further this vision of enabling intelligent devices everywhere.

Ambiq's Apollo510 MCU was purpose-built to create more capable endpoint devices that enable AI. The Apollo510 uses subthreshold technology to perform AI at lower power consumption levels than previously thought possible. This incredible reduction in power consumption allows endpoint device manufacturers to dramatically expand their devices capabilities, reducing dependence on the cloud. They can add intensive and complex features such as AI that sips power versus drains.

The Apollo510 upgrades its hardware from previous generations furthering its energy optimization per compute cycle. It uses the Arm-Cortex M55 with Helium to achieve better latency and power consumption. For perspective, an AI benchmark test demonstrated 22X better efficiency than the already best-in-class Ambiq Apollo4, and a nearly 300x improvement over typical Cortex-M4 devices. This makes the Apollo510 the most energy efficient use case for the Arm-Cortex M55 on the planet. This combination of performance and efficiency will allow our customers to deploy sophisticated speech, vision, health, and industrial AI models on battery-powered devices everywhere, marking the start of the age of truly ubiquitous, practical and useful AI.

LIPSedge™ S-Series High-Resolution 3D Stereo Camera with Edge-AI Enabled

Embedded Vision

LIPSedge™ S-Series High-Resolution 3D Stereo Camera with Edge-AI Enabled

Exhibitor: LIPS Corporation
Hall/Booth: 2/2-658

The absence of high-resolution 2D and 3D image capabilities, along with the lack of edge computing functionality, poses significant challenges in diverse industrial applications. The deficiency in high-resolution imaging for both 2D and 3D dimensions compromises data accuracy, impeding critical tasks like quality control, object recognition, and inspection processes.

In sectors such as robotics and Autonomous Mobile Robots (AMR), the inability to simultaneously acquire detailed 2D and 3D data leads to diminished precision in object recognition and manipulation. Furthermore, the lack of edge computing capability in the camera device gives rise to latency issues and bandwidth constraints, necessitating the transmission of camera data to remote servers for processing.

This reliance on centralized processing not only raises privacy and security concerns but also restricts functionality in offline environments, fostering increased dependence on expensive cloud services. The cumulative impact of these limitations reverberates across various industries, including manufacturing, healthcare, and virtual and augmented reality, detrimentally affecting the efficiency, accuracy, and overall capabilities of industrial processes. Addressing these challenges requires the integration of high-resolution 2D and 3D camera capabilities with edge computing, offering tangible benefits such as improved performance, reduced latency, enhanced privacy, and increased flexibility in deployment. 

The LIPSedge™ S-Series emerges as an innovative solution, strategically designed to address challenges in industrial automation. The device seamlessly integrates the Ambarella CV2 CVflow® SoC, delivering high-performance edge AI and image processing capabilities, including the essential deep neural network (DNN) processing required for intricate tasks.

As a next-gen 3D camera series, it goes beyond conventional capabilities by harmonizing high-resolution 2D and 3D image processing within a single camera, with roadmap achieving up to 4K RGB-D resolution. Specifically engineered for industries demanding a convergence of 2D imaging and 3D machine vision capabilities, the LIPSedge™ S-Series redefines possibilities. Its compact form factor is coupled with robust industrial capabilities, offering a versatile solution for a range of applications.

This device facilitates GigE/PoE data and power transmission across distances of up to 100 meters, housed within an IP67-rated rugged enclosure that ensures resilience against dust and water. The incorporation of a built-in IMU and heatsink enhances its adaptability for various applications, including but not limited to robotic pick & place, depalletizing, visual inspection, and Autonomous Mobile Robots (AMR). In essence, the LIPSedge™ S-Series not only meets the demands of industrial automation but surpasses expectations, presenting a sophisticated solution that adeptly tackles the identified limitations in the industry.


Codasip CHERI Technology

Safety & Security

Codasip CHERI Technology 

Exhibitor: Codasip 
Hall/Booth: 4/4-368 

Security vulnerabilities often hit the headlines. It’s been the case for some time now and does not seem to stop. The consequences for product makers, industries, governments, and end customers, are real. There is security and privacy of course – but also the cost of these data breaches. Each year, Microsoft lists CVEs (Common Vulnerabilities and Exposures) after analyzing cyberattacks. It appears that ~70% of the vulnerabilities they reported are caused by memory safety issues.

At Codasip we are convinced that the way CHERI technology revisits fundamental design choices in hardware and software will prevent this problem, and significantly improve system security. By adding protection against memory errors to the design, we are increasing the robustness of our IP to prevent cyberattacks resulting from memory misuse and unexpected software defects.

CHERI also improves safety by limiting the impact of memory errors within contained areas of code. Because CHERI technology can be applied selectively to critical functions, it is possible to enhance the security of existing products with a small effort, often through a simple code recompilation. The huge pool of existing C/C++ software can therefore still be leveraged in more secure systems. 

We are making Capability Hardware Enhanced RISC Instructions (CHERI) available in our RISC-V processor cores. CHERI extends conventional hardware Instruction-Set Architectures (ISAs) with new architectural features to enable fine-grained memory protection and highly scalable software compartmentalization. The technology has been developed by the University of Cambridge during the last decade and is now for the first time available in a commercially licensable product.

We are able to implement the CHERI technology thanks to Codasip Studio. This is our unique collection of tools for fast and easy designing or modification of processors. Using Codasip Studio, we have added built-in, fine-grained memory protection by extending the RISC-V ISA with CHERI-based custom instructions. To enable the use of these instructions, we are also delivering the software environment to take advantage of CHERI technology, bringing a full software development flow to add memory protection.

Key capabilities of Codasip Studio include rapid architecture exploration, automated generation of a custom compiler that understands custom hardware and how to take advantage of it, and automated generation of power and area-optimized synthesizable, human-readable RTL. 

MAX40109 Pressure Sensor System on Chip with Single Flow Calibration

SoC/IP/IC Design

MAX40109 Pressure Sensor System on Chip with Single Flow Calibration

Hall/Booth: 4A/4A-360

Today’s industrial pressure sensors use a resistive Wheatstone bridge that produces a small differential voltage which is prone to non-linear output caused by temperature and pressure variation. Existing solutions require a two-pass calibration to correct for this non-linearity. In the first pass, the pressure sensor manufacturers use an expensive laser trimming process to remove the unwanted common-mode offset. This adds a complex manufacturing step to the calibration process.

The second pass then implements linearization and temperature compensation. The MAX40109 is a low-power, precision sensor interface SoC that revolutionizes this process through a single pass calibration reducing overall system complexity and calibration costs. Single flow calibration reduces one-time factory calibration and test time by more than 30%. This process also removes up to 10 laser trim resistors from the existing system solution. Another design challenge is the overall solution size.

Discrete components such as amplifiers, ADC, DAC and DSP blocks are used alongside PTC for temperature measurement. This leads to larger solution size, higher system cost and longer time to market. MAX40109 is a high-precision, programmable SoC, with integrated ADC, MTP, DSP and a DAC. MAX40109 enables integrated temperature measurement directly from the bridge, removing the need for external thermistors. This reduces overall solution size by more than 70%. 

The MAX40109 simplifies the system design with the innovative features such as analog zero-pressure offset compensation up to ±93 mV/V and temperature measurement directly at the bridge. This reduces design complexity and system cost by removing the tedious laser-trimming process and reducing an external temperature sensor. The SoC also comes integrated with a DSP engine for 3rd order polynomial calculation which is a key block that generates the calibrated output, eliminating the need for an additional processor.

Another innovative aspect of MAX40109 is the combination of various digital and analog output schemes including Digital 1-wire, PLC and I2C interfaces, and Analog voltage (0 – 5V) as well as the current (4 – 20mA) output loop. The low-power operation, analog outputs and high voltage industrial Power-rail operation makes it directly compatible to work with Industrial systems.

RTI Connext® Drive 3.0


RTI Connext® Drive 3.0 

Exhibitor: Real-Time Innovations (RTI) 
Hall/Booth: 4/4-421 

Connext Drive® 3.0 is the flexible, future-proof, and data-centric communication framework for software-defined vehicles (SDVs). It expedites time to market by providing the first compliant platform-independent DDS-based solution to the highest functional safety standard, ISO26262 ASIL D. In addition, It secures between DDS, AUTOSAR Classic, AUTOSAR Adaptive and ROS 2. With Connext Drive 3.0, OEMs can get their next-generation vehicle to market faster by using the same framework from prototype to production.

Its unmatched architectural versatility minimizes the amount of custom communication and integration code users have to develop. Based on the Data Distribution Service (DDS™) standard, Connext Drive delivers on the promise of safer, more flexible and adaptable automotive systems by forging a pathway between functional safety and innovation. In automotive, RTI works with more than 25 companies who use Connext to accelerate their software-defined programs. 

Connext Drive 3.0 enables manufacturers to create safer, more flexible and adaptable communication architectures with less risk. RTI customers now have an optimal way to enable vehicle communication as their platform evolves because of our latest platform-independent solution. The communication is not limited to DDS, as Connext Drive provides interoperable solutions with AUTOSAR Classic, AUTOSAR Adaptive and ROS. Connext Drive paves the way for the next generation of software-defined vehicles and empowers manufacturers to innovate fearlessly while accelerating success.

The latest version of Connext Drive 3.0 includes:

  • Functional Safety: Connext Drive 3.0 is the first DDS-based communications framework that adheres to the highest functional safety standards (ISO26262 ASIL D).
  • A flexible, accelerated path to Certification: Connext Drive is the first platform-independent ASIL-D TUV SUD certified software; it eliminates the need for recertification if the vehicle operating system or network interfaces change.
  • A Solution to Bridge the Platforms Gap: RTI Connext Integration Toolkit for AUTOSAR seamlessly connects between DDS and AUTOSAR Classic/AUTOSAR Adaptive without custom code. 


Embedd - ML Generated Drivers


Embedd – AI Datasheet Analysis and Automated Driver Generation

Exhibitor: Embedd
Hall/Booth: 4/4-453

The integration of active semiconductor chips into devices is a costly process for the industry. Each year, over 865 million hours are spent on the manual, repetitive task of driver development. Embedded software developers must analyze heterogeneous, non-machine readable documentation and manually integrate it into code.

Given the variety of target architectures used in the market, from various RTOSs to bare-metal, porting these drivers can be a challenging task. Simultaneously, semiconductor manufacturers deal with a long tail of components that lack any software support packages, which becomes a sales friction point for them. 

Embedd uses artificial intelligence to analyse component datasheets and generates standardised digital component models that embedded software developers can configure. The configuration is done through a user-friendly application with VSCode integrations that allows to manage all driver related data and set up component based on the particular application. Users can then automatically generate driver code in C/C++ for their specific target architectures and compliance requirements such as MISRA or IEC 61508.


Embedded Wizard by TARA Systems


Embedded Wizard

Exhibitor: TARA Systems GmbH
Hall/Booth: 4/4-247

What is the main problem in GUI development? It encompasses a triangle of tension – embedded system engineers face the challenge of rapidly creating a GUI with a high performance, while also incorporating a cutting-edge design and simultaneously dealing with hardware limitations in terms of resources or even availability. We have made it our mission to eliminate this tension by providing our customers with a lean, versatile, scalable and fast GUI solution tailored precisely to meet these rigorous demands:

  • 1) Lean: One of the primary issues is the limitations in microcontroller environments. Embedded Wizard is designed for a smooth and easy UX, excelling in optimizing performance on any hardware. By providing a GUI solution with a minimal footprint, it empowers developers to create feature-rich interfaces without compromising on system resources.
  • 2) Versatile and scalable: Embedded Wizard stands out for its platform independence, allowing developers to create GUIs that seamlessly run on various hardware architectures, from small to big platforms, with a minimum memory footprint of just 16Kbyte of RAM.
  • 3) Fast: With its intuitive design and WYSIWYG editor, Embedded Wizard drastically expedites the time and programming effort for GUI development, minimizing the likelihood of errors. Moreover, real-time rendering and fast prototyping capabilities allow for quick adjustments. Most importantly, the created GUIs excel in term of speed.

Embedded Wizard 13, launched in November 2023, goes beyond enhancing performance or design. Our product promotes sustainable resource usage by offering extensive platform support, ensuring versatility across a wide range of devices. It is not only geared towards the latest systems but can also be seamlessly implemented on existing legacy systems and older hardware, mitigating waste.

This adaptability ensures that businesses with established infrastructures can harness the power of modern GUIs without the need for a complete overhaul, maximizing the return on investment for existing technology assets. We have prioritized sustainability for new systems as well, by optimizing energy efficiency with the introduction of modernized widgets. What sets these widgets apart is the use of vector graphics. Vector graphics are resolution-independent, resulting in smaller file sizes compared to high-resolution bitmaps, and thus optimizing memory usage.

They prove especially sustainable when applied to flat or less complex formats, icons or elements. This efficiency in storage is crucial for resource-friendly applications. Moreover, in terms of responsive design, vector graphics excel in adapting seamlessly to various screen sizes and resolutions without compromising quality, reducing flash memory usage and eliminating the need for multiple versions of images. This translates into improved sustainability and usability for end-customers



The community choice award goes to...


Exhibitor: STMicroelectronics
Hall/Booth: 4A/4A-148

This project within our company was designed solely in Europe. The module itself and all internal integrated circuits are entirely designed and produced by ST in Europe only, which ensures control and management on the complete supply chain. This represents a unique offering on the market in terms of quality, safety and longevity of the products. It gives our customers a major advantage especially in the Metering market (water, gas, electricity meters).

The STM8701 offers flexibility for product developers, presenting a fully programmable IoT platform that lets users embed their own code directly in the module for simple applications. Alternatively, the module can be combined with a separate host microcontroller, permitting many more sophisticated use cases. The ST87M01 combines ST’s know-how, including microcontrollers, AI solutions, sensors, actuators, PMUs, converters, interfaces, memories to enable next-generation IoT ecosystems.

Bringing together reliable geolocation capability with long-term assured cellular connectivity, the ST87M01 module addresses emerging massive IoT applications such as smart traffic-emergency lights, to become mandatory in Spain by 2026. The new lights supersede the passive emergency triangle, by providing real-time car geolocation to the local traffic-control system in the event of accident, consistent with the European road safety charter. 

STMicroelectronics’ ST87M01 ultra-compact and low-power modules combine highly reliable and robust NB-IoT data communication with accurate and resilient GNSS geo-location capability for IoT devices and assets. The fully programmable, certified LTE Cat NB2 NB-IoT industrial modules cover worldwide cellular frequency bands and integrate advanced security features. 
The ST87M01 provides extended multi-regional LTE coverage. The integrated native GNSS receiver with multi-constellation access ensures enhanced and highly accurate localization along with optimized power savings features. 

The ST87M01 provides with ultra-low power consumption — less than 2µA in low-power mode — and transmit output power up to +23dBm, the ST87M01 targets wide-ranging IoT applications that require ultra-reliable Low Power Wide Area Network (LPWAN) connectivity. These include smart metering, smart grid, smart building, smart city and smart infrastructure applications, as well as industrial condition monitoring and factory automation, smart agriculture and environmental monitoring.

The modules also integrate a state-of-the-art ST4SIM embedded SIM (eSIM), certified according to the latest industry standards, such as the recent GSMA eSA (Security Assurance) certification, that further enhances asset miniaturization and security. There is also a state-of-the-art embedded secure element (eSE).