25 - 27 February 2020 // Nuremberg, Germany
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The latest industry news
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Tektronix Showcases Innovative Test Solutions at Embedded World 2020. From Engineers. For Engineers.
Tektronix, Inc., a leading worldwide provider of measurement solutions announced today that the company will be showcasing a wide-range of test and measurement products at Embedded World 2020. Visitors to the stand will be able to get hands-on demonstrations.
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1 µF/mm² for 3D Silicon-integrated Microcapacitors
Researchers from the University of Pisa report that they have been able to manufacture silicon-integrated three-dimensional deep trench microcapacitors using the widely used Atomic Layer Deposition (ALD) technology from Picosun. These devices achieve an area-specific capacitance of 1 µF/mm².
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SMART Modular to Highlight Benefits of Persistent Memory use in Artificial Intelligence and Machine Learning Systems at SC19
Developers need to consider bandwidth and latency when incorporating memory into systems designed for Artificial Intelligence and Machine Learning applications.
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First SSD Product Family with SMART Modular Proprietary NVMSentry™ Firmware
Read the latest press release from the exhibitor SMART Modular.
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B6SE-868-03NJ - LoRa®/LPWAN Light Duty Base Station
Robust communication for LoRaWAN networks
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