Synergie Cad PSC, Europe’s leading post silicon backend packaging and test services provider welcomes any business involved in the design and supply of semiconductor SOC and ASIC devices to visit us at Embedded World 2026, (HALL 4 , BOOTH 4-471).

From within Europe, at its Toulouse headquarters in the South of France, Synergie Cad PSC uniquely provides advanced packaging design, and manufacturing along with all post tape-out backend services including assembly, wafer and final test, reliability/qualification test and characterization.

Covering every type of device, Synergie Cad PSC has vast experience servicing analog, mixed-signal, and RF or MMW devices fabricated on many process nodes and large digital devices on advanced FinFET nodes for HPC and AI applications.