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Key Facts
- System concepts and exploration as well as concepts for power delivery (e.g. in package regulators), heat removal (e.g. new materials) and robustness
- Die-to-Die interface electronic development up to 5nm
- Robustness tests (e.g. thermal cycling, mechanical stresses, vibrations, oscillations), bring-up and characterization
Categories
System-on-Chip IC Design Other System Development
Product information
The innovative chiplet approach offers great potential for the automotive and industrial sectors. The modular principle behind chiplets enables efficient design and production: individual components have to be produced only once and can then be flexibly combined to create tailored solutions.
By integrating various functional units, chiplet technology enhances performance through the opportunity to involve mixed processing nodes from major nodes down to 5nm, as well as more specific technologies such as SiGe and GaN. This offers major advantages when it comes to the cost-effective production of high-performance specialized chips.
Fraunhofer IIS is researching specialized chiplet solutions that meet the requirements for long-term stability and reliability. Particularly ...Product Expert
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