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25 - 27 February 2020 // Nuremberg, Germany

Conferences and supporting programme

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Presentations Exhibitor´s Forum

Overview of ADI 3D Depth Sensing Technology with an introduction to ADIs TOF embedded processing platform... Vortragssprache Englisch

An introduction to ADIs TOF 3D sensing technology. This is high performance VGA resolution depth imaging solution. Target use cases are for industrial, consumer and automotive, for navigation, gesture, logistics, collision avoidance, safety...This session will also introduce some of the new tools useful to aid customer design, such as a complete TOF processor platform to aid fast customer design with no hardware/software development needed.

--- Date: 26.02.2019 Time: 15:30 - 16:00 Location: Exhibitor's Forum, Hall 3, 3-719

Speakers

man

Brian OLoughlin

Analog Devices GmbH

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