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1 - 5 March 2021 // DIGITAL

+++ The entries in the exhibitor & product database correspond to the registration status for embedded world 2020. +++

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Exhibitors & Products embedded world 2020
Zoom Image LOGO_ATP Industrial Temperature (ITemp) MLC NAND Flash Solution

ATP Industrial Temperature (ITemp) MLC NAND Flash Solution

LOGO_ATP Industrial Temperature (ITemp) MLC NAND Flash Solution

ATP Industrial Temperature (ITemp) MLC NAND Flash Solution

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ATP Industrial Temperature (ITemp) MLC NAND Flash Solution strikes a great balance between cost as well as placing memory reliability as its priority. By conducting strict ITemp validation testing technologies in both IC/NAND Flash level screening processes and H/L temperature tests, MLC type NAND Flash reliability is ensured and uncompromised in extreme temperature environments (-40°C~+85°C), placing itself in the market segment where normally SLC type NAND competes.


  • Quality and Reliability
    • IC Level Test for proper ECC Criteria Setting
      • Different levels of ECC bits/1KB setting tested across varied  H/L temperatur(Finding out the best suited ECC criteria for further RDT reference)
    • Product Level RDT for Reliability Enhancement
      • Based on the features of NAND instead of pure brute force copy compare
      • Adopt stress read/write burn-in test at -40°C and +85°C
      • 100% tests the whole drive (firmware, user and spare area) block by block
    • SATA Interface Testing for Signal Quality*(SATA storages only)
      • Verify that signal quality is at an optimal level for SATA device running at high velocity
  • Roadmap Stability
    • Longevity

With years experience in NAND flash technology and solid relationship with key suppliers, ATP has spent enormous effort in building both validations and IC packaging capabiliti to support industrial customers’ long-term product life cycle demands. Better management, fast reaction, and extended product longevity to side with clients to face dynamic market changes


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