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Giga-snaP™ 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patent pending female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
EMC´s experienced connector technology team has been successfully supporting users in the electronic industry since 1982.
Our product range primarily consists of high quality sockets for BGA, QFN, MLF and a wide variety of adapters which are ideally complemented by connectors and cable assembly solutions.
Our longstanding experience of working with many developers has resulted in our specialization in high-quality connector systems which has lead to our main focus being on customised solutions.
We work closely with our customers and our production sites in Switzerland, Taiwan and the USA to develop ideal solutions.
EMC – Expertise due to qualification and experience.