ICP Deutschland GmbH Industrial Computer Products

Specifications

• 15” stainless steel Panel PC with 1024x768 resolution
• Resistive or capacitive touch
• IP69K protected front
• Intel® Skylake ULT processors
• Max. 32GB DDR4 SO-DIMM memory (4GB pre-installed)
• Seven M12 connectors for RS-232, GbE LAN, USB 2.0and DC Jack
• Expansions: One Full-size, one Full-/Half-size PCIe Mini Card and one M.2 B-key slot
• One 2.5” SATA 6Gb/s SSD drive bay and one mSATA slot
• Extended input voltage: 9~36VDC
• Operating temperature: -20°C~+50°C

Applications

• Packaging and food industry
• HMI applications in extreme environments

Stainless steel panel PC with IP69K protection

ICP Deutschland offers with the INOX-F15C-ULT3 an industrial Panel PC, which is especially suited for HMI applications in the packaging and food industry. This requires a flat stainless steel housing that has no edges and a minimum gap width as well as is provided with external seals. The INOX-F15C-ULT3 can be easily cleaned with high-pressure and steam blasting units due to the high dust and splash protection on the front (IP69K) and the rear (IP66) of the 15" Panel PC. The integrated displays are particularly long-lasting thanks to a mean time between failures (MTBF) of 70,000h. The INOX-F15C-ULT3 is with resistive or capacitive touch available, whereby the PCAP model consists of a particularly safe glass of the hardness 6. Its suitability for industrial use is supported by sealed M12 connectors, an extended voltage input of 9VDC ~ 36VDC and an operating temperature of -20°C ~ +50°C. Its computing power is based on an Intel® Skylake ULT Core™ i5 or Celeron® processor with max. 32 GB DDR4 SO-DIMM memories. At the rear are two RS-232/422/485, GbE LAN and USB 2.0 ports lead out via M12 connectors, which offer flexible connection possibilities for external machines. As expansion slots, a full-size and a combined full-size / half-size Mini Card and a M.2 are available. A removable 2.5" SATA 6Gb/s SSD drive bay is recessed into the housing at the rear that offers simple assembly of the desired mass storage device. On customer request, the stainless steel housing can be equipped with a suitable VESA mount for attaching a support arm.

Specifications

• Cloud-based IPC with QTS operating system
• 12”~19” capacitive or resistive touch
• Intel® Celeron® J1900 Quad Core SoC
• 4GB DDR3L SO-DIMM memory
• USB, RS-232, RS-232/422/485
• Two PCIe Mini slots
• Software Features: Remote management QRM+, rules engines, message broker & dashboards
• Recommended storage capacity: 500GB

Applications

• Edge computing
• Direct processing and visualization of machine data

2-in-1 solution – IIoT Edge PC and visualization in one

The direct processing of machine data at the edge offers the advantage for IIoT applications to operate independently of the cloud and of any possible bandwidth problems. An IIoT Edge PC is particularly user-friendly when the recorded data and the defined processes can be visualized live on the machine. ICP Deutschland offers such a 2-in-1 solution with the Cloud-based IPCs PPC-F-QGW. The series is equipped with 12 "~ 19" displays, which have a capacitive or resistive touch. Inside, a powerful and fanless Intel® Celeron® J1900 SoC works with 4GB DDR3L SO-DIMM memory. For the transmission of the machine data common interfaces such as Dual GbE, USB as well as proven RS-232/422/485 are available. In addition, two mPCIe slots provide flexible expansion options. The Cloud-based IPC series is already equipped with a special IIoT software package, including a pre-installed Embedded Linux QTS operating system, standardized apps and free software tools. The container-based apps undertake for instance functions such as remote management using the QRM+ software, data processing and definition of processes using the rules engine Node-RED or translating industrial protocols into IoT protocols such as MQTT or CoAP. The extended voltage input of 9 ~ 36VDC, the operating temperature of -10~50°C and the possibility of panel or rack mounting enable a flexible use in the industrial environment right at the machine. In order to defy harsh environments, ICP Germany offers the cloud-based IPCs with IP65 protected aluminium enclosures. These can be combined with different support arm variants and internal wiring.

Specifications

• Cloud-based IPC consist of: Proven industrial hardware from IEI and QNAP software package: Linux based QTS OS, pre-installed software and standardized tools
• Models: Compact and powerful embedded PC and fanless panel PC
• Advantages: No license fees, wide range, easy software configuration
• Features: Remote Device Management, virtualization, data security/backup, private/public cloud management

Applications

• IIoT and Industry 4.0
• Gateway function
• Edge computing

Cloud-based IPC

ICP Deutschland offers under the brand IEI the new QGW series (QTS-GateWay) as cloud-based IPCs. The hardware of IEI and the software know-how of QNAP are successfully combined in the cloud-based IPC. IEI has been convincing for 20 years as the leading hardware manufacturer of industrial computers. QNAP, the market leader in NAS systems, complements the QGW series with a software package specifically designed for IIoT, consisting of a Linux-based QTS operating system, preinstalled software and standardized tools. The results of this in-house teamwork are QTS-Gateways, which sustain the progressive digitization and networking of processes, machines and systems. True to the motto IEI x QNAP, ICP offers its customers solutions for the IIoT and the age of industry 4.0. The advantages of the cloud-based IPC are versatile: No license fees, wide range of gateway solutions, standardized tools and easy software configuration. With the integrated QTS operating system functions like remote device management, virtualization, data security and backup as well as private and public cloud management are instantly implemented. With this, ICP gives system integrators and software providers an open and cost-effective platform, which is both standardized and flexible, so that a large number of customer-specific IIoT solutions can be realized in different application fields. The choice of cloud-based IPC ranges from compact and powerful embedded PCs to fanless panel PCs. ICP supports the entire implementation process, project-based, with technical documentation and provides important know-how transfer.

Specifications

• Embedded box PC with 6th generation Intel® CoreTM i7 or i5 processor
• Intel® H110 chipset
• Max. 32GB DDR4 SO-DIMM memory
• One 2.5” SATA 6Gb/s slot
• Internal power connector
• Three 3 slot expansion models: PCIe x4/x16, PCI and two full-size PCIe Mini card
• USB 3.0, COM ports, GbE LAN ports
• Dual independent display support: VGA, HDMI 1.4
• MIL-STD-810G certified
• Operating temperature: -20°C~+50°C

Applications

• Machine control
• Automation

Energy efficient, compact and extendable

Energy efficient, compact and extendable - three features that describe best the Embedded Box PC TANK-870e-H110 from ICP Deutschland. The TANK-870e-H110 convinces with high-performance Intel® quad-core i7 or i5 processors (max 32GB DDR4 SO-DIMM memory) and is very energy efficient at the same time due to the max. 35 watts TDP. Embedded in a fanless and compact aluminum housing with the dimensions of 132x255x190mm, the TANK-870e-H110 is equipped with three expansion slots by default. There are three backplane variants with PCIe x4, PCIe x16, PCI and two full-size PCIe Mini card slots available. Via the internal power connection (max. 36W) add-on cards can be supplied with sufficient current (5V or 12V). The front I/O interfaces include four USB 3.0, two isolated RS-232/422/485 (overvoltage protection up to 2.5KV), two RJ-45 GbE LAN and audio. Two independent displays can be connected via VGA and HDMI 1.4 (4K UHD) interfaces. The extended voltage input 9VDC ~ 36VDC and the temperature range -20° C to + 50° C as well as the vibration protection according to MIL-STD-810G allow the TANK-870e-H110 to be mounted directly on the machine. As a Ready-to-Use system, the Embedded Box PC is optimally designed for machine control and automation due to its compatible components and immediate readiness. For more complex applications, the TANK-870e-H110 is available as a 2-slot or 4-slot expansion model with additional features.

Specifications

• 3.5” CPU Board with combined cooling and mounting plate
• Intel® 6./7. Generation i7/i5/i3 or Celeron® processor
• Max. 8GB DDR4 SO-DIMM memory and 8GB on-board memory (optional)
• USB, COM ports, SATA 6Gb/s, dual PCIe GbE
• Expansions: Two Full-size PCIe Mini card slots with mSATA support or on-board SIM holder
• Triple independent displays: HDMI (4K UHD), LVDS und internal DisplayPort
• Power input: 12VDC
• Operating temperature: -20°C~+60°C

Applications

• Embedded PC & display solutions

Benefit from more performance and intelligent integration

System integrators and users of embedded PCs and display solutions will soon benefit from the new version of the proven WAFER-ULT series from ICP Deutschland. More performance with low waste heat and a wide selection of Intel® Skylake and Kaby Lake processors are the main advantages of the 3.5" CPU board.
The performance of the new Intel® platforms for CPU and graphics has increased by over 10% and 30%, respectively. With a maximum waste heat of 15W TDP of the various Intel® i7 / i5 / i3 or Celeron® processors, users are spoilt for choice. Particularly striking is the ingenious integration of the cooling and mounting plate of the WAFER-ULT3 / ULT4. The special design of the mainboard allows the waste heat of soldered SoC, on the bottom of the board, to be discharged effectively and directly to the outside. In this way, particularly slim embedded systems can be implemented. Up to three independent displays can be connected for embedded display solutions. This is made possible by an HDMI (4K UHD resolution) and an LVDS interface as well as an internal DisplayPort (iDP). Via an optional adapter the iDP can be converted to HDMI or DP. The two PCIe Mini card slots can be used for expansions around WLAN, 3G / 4G or industrial mSATA modules. At the customer's request, ICP Deutschland also integrates an on-board 8GB DDR4 SO-DIMM memory and provides the WAFER-ULT3 / ULT4 as a Ready-to-Use system.