GF Micro

We can deliver turn-key designs or bespoke consultancy across diverse chip technologies and applications. To ensure best possible performance, power efficiency and on-time delivery we use a proven combination of in-house and third party IP.

Planning
Reflecting this approach is our ability to offer much more than basic silicon design. To help achieve a finished and fully working chip we can also incorporate detailed implementation plans. These allow our customers to realise a complete chip solution based on selected packaging technologies and test methodologies.

Packaging
Our customers are always looking for innovative packaging solutions. Twenty-five years of chip design projects has seen us develop experience of a wide range of package technologies. In addition to supporting standard package types we also offer a number of development packages for first silicon evaluation.

Test Development
To help customers achieve a full silicon solution that they can use for sample purposes, as well as volume production, we offer various levels of test development. For basic implementation we provide a bring up service which gives customers a device that is fully functioning and tested.

Involving only one point of contact and one supplier, we offer customers a full turnkey service across diverse markets, covering low volume/high reliability solutions through to large volume consumer applications.

Assuming a supply chain management role, we identify and work with strategic partners to develop and validate a manufacturing and production test flow that fits with our customers individual requirements.

We manage the sourcing process in its entirety from silicon manufacture and device package/assembly through to production test and inventory management.

This proven model gives customers the ability to rapidly scale their manufacturing flow, with no impact on quality or performance.