LPKF ProtoLaser U4
During PCB laser processing, the laser beam cuts the copper layer by vaporizing the copper along the cutting channel. This occurs with such precision that the substrates below are not affected. LPKF has developed a second processing mode for larger ablations whereby the copper layer is first cut into fine strips and then removed – much more quickly than by vaporization.
The LPKF ProtoLaser U4 uses a laser wave length of 355 nm, similar to that of UV light. LPKF thus has a particularly broad processing range, because the absorption rates for the different material groups vary widely. The ProtoLaser U4 can therefore be used for structuring printed circuit board materials and for processing more demanding substrates: unfired and fired ceramics, LTCC, cutting applications and drilling in FR4 and polyimide, high-precision structures on sensitive RF materials… and much more. Precise stabilization in the low energy range means even sensitive substrates or thin organic layers can be processed with this laboratory laser.
The extensive features make it highly flexible: the ProtoLaser U4 uses a vision system to detect fiducials, a vacuum table for planar processing of flexible materials, and output measurement at substrate level for reproducibility and documentation of work results.
The LPKF ProtoLaser U4 is like a Swiss Army Knife for the development lab – it can process a large number of materials with a level of precision and speed that even series production processes do not always achieve.