27 February - 1 March 2018 // Nuremberg, Germany

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Exhibitors & Products embedded world 2018
Zoom product LOGO_Thermal Solutions

Thermal Solutions

LOGO_Thermal Solutions

Thermal Solutions

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As semiconductor device functionality & speeds increase, getting the heat off and away from the device becomes crucial. PCB’s are inherently constructed from laminates with impressive electrical characteristics but in general poor thermal conductivity. Even the very best laminates struggle to achieve ( 4W/m/K).

EES-PCB offers a suite of thermal solutions ranging from complete post-bonded heatsink attachments to local coin placements which facilitate greatly enhanced ( 400Watts per meter Kelvin  ) thermal conductivity.

Precise, customized solutions can be pressed into, embedded into or bonded onto the PCB to facilitate dissipation. Solutions which are “SMT Ready” and which simplify product assembly.

EES-PCB thermal solutions are life cycle tested, industry proven, lead free compatible techniques, that can be implemented precisely, even on complex high density PCB designs. We’ve been doing this for more than 20 years already.

EES-PCB,  Exceptionally Engineered Solutions. 

Zweiseitige Leiterplatten

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Polyflex

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Ultra Thin Dielectrics

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Thermal Solutions is assigned to following product groups:

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