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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2018
Zoom product LOGO_Heat Pipe/Vapor Chamber Thermal Module

Heat Pipe/Vapor Chamber Thermal Module

LOGO_Heat Pipe/Vapor Chamber Thermal Module

Heat Pipe/Vapor Chamber Thermal Module

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Combining various technologies to solve various thermal needs such as vapor chambers with soldered fins or heat pipes soldered into an extrusion. These are commonly used in laptop, desktop, server, and data center, even in smart phone and tablet. Normally vapor chambers will replace the traditional metal base of a heatsink to cool high powered solutions. In comparison heat pipes can be added to make a tall 4U tower heatsink, move heat from the chip to a condenser, or provide a lower powered solution to a vapor chamber.

Various Components: Stacked fins, extrusion, skiving, die casting



Vapor Chamber

LOGO_Vapor Chamber

Loop 3D Vapor Chamber

LOGO_Loop 3D Vapor Chamber

Liquid cooling/Cold plate

LOGO_Liquid cooling/Cold plate

Heat Pipe/Vapor Chamber Thermal Module is assigned to following product groups:


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