Combining various technologies to solve various thermal needs such as vapor chambers with soldered fins or heat pipes soldered into an extrusion. These are commonly used in laptop, desktop, server, and data center, even in smart phone and tablet. Normally vapor chambers will replace the traditional metal base of a heatsink to cool high powered solutions. In comparison heat pipes can be added to make a tall 4U tower heatsink, move heat from the chip to a condenser, or provide a lower powered solution to a vapor chamber.
Various Components: Stacked fins, extrusion, skiving, die casting