A System-In-Package consists of a number of dissimilar integrated circuits enclosed in a single highly miniaturized package. The SiP performs all or most of the functions of an electronic system, and, it can contain several silicon components (bare die or package) and passive components.
3D PLUS provides a one-stop source for customer’s concept analysis, feasibility study, design, manufacturing and test of High Reliability and High Performance SiP.Our SiP solutions embeds best standard semiconductor devices and technology in one single highly miniaturized package with almost no limit for the merging of heterogeneous technology (Die – Package – Sensors - Passives) and form factors.
3D PLUS SiP design capabilities include Digital, Analog, Power and RF electronics.
Our SiP modules can be shaped with various form factors and can be delivered with several I/OS types.