Ironwood Electronics has recently introduced a new high performance BGA socket for high speed probing of the memory chip and debugging of the system during the design phase, designed for 1 GB Mobile DDR2-S4 SDRAM. The contact resistance is typically 20 milliohms per I/O. The socket connects all pins with 10 GHz bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. The socket also incorporates a new quick insertion method so that IC's can be changed out quickly. Customer can use this stacked socket to probe 1 GB memory device using Agilent's Flex Probe stacked inside the socket.
The sockets are constructed with a high performance and low inductance embedded silver particle elastomer as interconnect material between the device and flex probe. The temperature range is -35C to +100 C. The pin self-inductance is 0.11 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin.