The increasing integration density of printed circuit board assemblies and the increasing amounts waste heat generated by the electronic components pose ever greater challenges for the cooling concept of the cases that are used. For these applications and available immediately, Fischer Elektronik now offers its customers a recently developed series of cases, the GE K... which has optimal heat dissipation properties. The new, one side open, U-shaped profile of the cases contain integrated guides to fit electronic components or circuit boards as well as an insertable heatsink which assures the function of heat dissipation to the surroundings. It is dimensionally adjustable to the cooling concept of any assembly. Fixing the heatsink is through front and rear covers that are bolted to the profile of the case. As standard, the case series is available in three different sizes, seven lengths (50, 80, 100, 120, 160, 200 and 220 mm) and in two surface finishes (natural and black anodised). The basic case, the heatsink as well as the covering plate can be mechanically machined, surface-treated and printed according to the customer’s requirements. The GE K… cases are supplied as a disassembled assembly set including the covering plate and assembly accessories.