Reliable through-hole plating is key to the success of the challenging PCB prototyping process. The new LPKF Contac S4 unites various galvanic and chemical processes in a minimal space.
Despite its small footprint, the LPKF Contac S4 incorporates powerful techniques for improving copper layer buildup. New anode plates and pulse reverse plating ensure homogeneous deposition, and carbon activation using the black hole technique, optimized air blow-in, and the via cleaning process step eliminate the problem of layer detachment. The result is a homogeneous layer thickness in the holes and on the flat metal surface of the substrate.
An integrated touch panel with a wizard and parameter administration safely guides even inexperienced users through the galvanization process. The intuitive control enables developers to customize settings.