BIWIN ePoP5x integrates LPDDR5X DRAM and eMMC storage, leveraging cutting-edge multi-die stacking, ultra-thin die, and heterogeneous multi-chip integration technologies to deliver an industry-leading solution. With a compact dimension of 8.0 mm × 9.5 mm and a thickness of just 0.54 mm, this advanced solution integrates traditionally discrete RAM and ROM into a single, highly miniaturized module designed for space-constrained devices including AI AR glasses.

The ePoP5x enables up to 75% reduction in PCB area, significantly improving structural design flexibility for compact, highperformance designs. It can be mounted directly on the main SoC, enabling ultra-thin and lightweight system designs. With flexible capacity options of 64 GB + 2 GB/3 GB/4 GB, it strikes an optimal bal ...