Diese Website verwendet Cookies, um das Angebot nutzerfreundlicher und effektiver zu machen. Mit der Nutzung dieser Website stimmen Sie der Verwendung von Cookies zu.Weitere Informationen über die Verwendung von Cookies und die Möglichkeit der Verwendung von Cookies zu widersprechen, finden Sie hier.
HM-BT4502 is a wireless data pass-through module based on CMT4502 Bluetooth Low Energy 5.0 chip. By connecting with MCU, it can quickly realize the connection and data communication between the module and Bluetooth devices such as smartphones and tablets. MCU takes up less resource and development is simple. Module Features Easy to use without any experience in Bluetooth stack application User interface uses universal serial port design, full-duplex two-way communication, minimum baud rate support 9600 bps Default connection interval is 30 millisecond, fast connection Support 2M symbol transmission Support 244 bytes packet transmission Support AT instruction for software reset and get MAC address Support AT instruction to set Bluetooth connection interval and control different forwarding rates (dynamic power adjustment) Support AT instruction to adjust Tx power, modify advertisement interval, customize advertisement data, customize device identification, set data delay (user MCU serial port reception preparation time) Electrical Characteristics Working voltage: 1.8V-3.6V Working temperature: - 40℃~125℃ (built-in BLE main IC working range) Modulation mode: GFSK (Gaussian Frequency Shift Keying) Modulation frequency: 2402MHz-2480MHz Transient current of receiving data: less than 8mA@3V Transient current of sending data: less than 8mA@3V@0dBm Current in the low power mode: less than 4uA@3V Tx power: - 20dBm ~+8dBm Rx sensitivity: -97dBm
Leider gibt es für diesen Aussteller kein deutsches Firmenprofil.
Shenzhen Hope Microelectronics Co., Ltd.(hereinafter referred to as "HOPERF"), established in 1998, is a national level high tech company which specialized in the design and manufacture wireless radio frequency and sensor products. With a global operation comprising a vertically integrated factory, HOPERF has developed into the first intact industry chain group company in China which integrating ASIC chip design, MEMS sensor chip design, package test calibration technique and application services.
HOPERF has a top R&D team with more than 80 global employees, and 60% of them are professionals that from international top-grade enterprises in Germany, United States, Switzerland, etc. HOPERF has multiple international leading technologies in internet-of-thing field, and the unique patent "NextGenRF" algorithm in chip design aspect can fill up the blank in domestic. It also got 8 enterprise certifications, 26 special inventions and 9 software copyrights.
HOPERF has a 30,000 square meters’ modern manufactory in Wuxi Taihu Technology Park and imported advanced top-ranking encapsulation & testing equipments with high-precision test measuring system which can perform strictly production management according to ISO9001 thus to fully ensure the reliability and stability of product quality.
HOPERF's products have already applied in 33 countries and served for more than 1000 brand customers from world-wide. Our products were comprehensively applied in Outdoor Sport, Electronic Navigation, Industrial Measurement, Environmental Monitoring, Medical, Smart Health, Diving and Aircraft etc.