FLC-MCM63X is a LTE Cat.3 module, use LTE 3GPP Rel.8 technology, support maximum downlink rate and maximum uplink rate up to 100Mbps and 50Mbps respectively. Compatible with FLC-MCM530 on package, achieve seamless handover between 3G and 4G network. MCM63X support MIMO technology, and combines high-speed wireless connection and built-in high-precision positioning GPS+GLONASS receiver. With abundant network protocols, can be widely used in vehicle, security, data card and industrial grade PDA and so on.
Chip: Qualcomm MDM9X15
Technical standards and bands:
Memory: LPDRR 2Gb + NAND FLASH 4Gb
Processor: ARM Cortex A5 Processor
Interface: ①1 * USB 2.0 high speed port（maximum 480Mbps）
②2*1.8V/3.0V (U)SIM port
③1* UART 4Mbps（high speed）
⑤1*JTAG debug port
⑦1*I2S/PCM,1* I2C audio port
Working temperature: -40ºC to +85ºC
Package: ①Type: LGA package（with a full metal shield）
②Dimension: 36mm*38mm*3.5mm (without packaging)
Leider gibt es für diesen Aussteller kein deutsches Firmenprofil.
Flaircomm Microelectronics, Inc. is a high-technology enterprise focusing on developing high reliability, high quality and cost-effective wireless modules, embedded software and wireless communication solutions for IOV and IOT.
Our headquarter is in Fuzhou, China. We set up two R&D centers in Shanghai and Xiamen, core R&D team is introduced by Fujian Provincial Government, all of them are dedicate to telecommunications technology research and wireless communication development for many years. And we have three factories in Fuzhou, Shenzhen and Nanjing, providing powerful manufacture and supply chain support.
Embedded software: Protocol stack, Noise inhibition and echo cancellation
In the past years, Flairmicro has realized almost 100% turnover growth and have become the No.1 supplier of vehicle communication products for automotive before-market in China. Also we have established good relationship with our customers, covering more than 20 countries and over 150 companies such as Desay SV Auto, Clarion, Delphi, Fujitsu Ten, HSAE, Pioneer, etc.
In the future, we will vigorously explore international market and provide more competitive products and better service for the customers. Also we will release two new bluetooth module BTM701/702 (Bluetooth 5.0 dual-mode, used QCC300x solutions) in Embedded world 2018. The new launches are well applicable for Bluetooth Car Speakers, Bluetooth Speakers, Stereo Bluetooth Headphones etc.