The X-Chip Series is a range of low power, low pin count, next generation USB interface ICs with an extensive feature set that includes integrated USB battery charger detection capability.
Made up of devices in 13 different package options, the X-Chip series complements FTDI Chip's existing FT-R and FT-H offerings. The series supports a broad selectoin of interface sypes, such as basic UART, full UART, FIFO and I²C, as well as FTDI's proprietary FT1248 I/O (including provision for enhanced SPI).
Key Hardware Features include:
I/O levels from 1.8V to 3.3V (5V tolerant)
Extended operating temperature range: -40°C to 85°C
Low operating current: 8mA (typical)
Battery charger detection to enable higher current, faster charging
Extensive clocking capabilities; internal clock generation and external clock out
Internal 3.3V regulator
Integrated crystal and Multi Time-Programmable (MTP) memory to save board space and maximize flexibility
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FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineeers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. These platforms enable creation of electronic designs with high performance, low peripheral component requirements, low power budgets and minimal board real estate.
FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip. The unique, streamlined approach utilised by these ICs allow dramatic reductions in the development time and bill-of-materials costs involved in next generation Human Machine Interface (HMI) implementation. FTDI Chip also provides families of highly-differentiated, speed-optimised microcontroller units (MCUs) with augmented connectivity features, specifically designed with compatibility to its USB and Display product lines in mind. These MCUs are targeted for key applications where they can add value with their superior processing performance and high levels of operational efficiency.
FTDI Chip is a fab-less semiconductor company, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and techical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China).
To better serve the broadening range of markets it has developed products for, FTDI Chip has established a new distinct company, Bridgetek.
Bridgetek is a leading global semiconductor company providing high performance microcontroller units (MCUs), display IC products and developing innovative silicon solutions that enhance seamless interaction with latest connectivity technologies. The key objective from the company is to provide core bridging technology in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. These platforms enable creation of electronic designs with high performance, low peripheral component requirements, low power budgets and minimal board real estate.
Bridgetek resources will be devoted to two particular product areas; the multi-award winning Embedded Video Engine (EVE) graphic controller ICs which enable engineers to implement more sophisticated human machine interface (HMI) systems, plus the unique and equally innovative performance-optimised microcontroller units (MCUs) with their expansive array of different connectivity options and industry-leading processing speeds.