The New Form Factor Standard for Ultrabook
Ultra Slim——3.2mm High Only
Ultra Fast——SATA III 6Gbps Interface
Form Factor: NGFF(Next Generation Form Factor)
Interface: SATA III 6Gbps
Max Transfer Performance(Varies by density): Read: 510MB/S
Dimension（mm）: 80x 22x 3.2 mm
Flash Type: MLC
OS Compatibility: Windows 7 / Windows Vista / Windows XP / Win2003
MTBF: 2 million hours
Operating Voltage: 3.3V ±5%
Power Consumption: 0.38W(idle）1.30W（active）
Operating Temperature: 0℃-70℃
Storage Temperature: -40℃-85℃
Humidity: 5% to 95%
Leider gibt es für diesen Aussteller kein deutsches Firmenprofil.
Founded in 1995 as an electronic product manufacturer in Shenzhen , BIWIN specializes in the application and production of NAND FLASH and micro electronics. Our products and services include solid state drives, embedded chips, SIP modules, as well as packaging and testing services.
Our investment in production facilities is approaching 100 million dollars. We established our 12" wafer packaging factory in 2009, which is the first one in South China. Our 12,000 square-meter factory and dust-free workshop (with 1k level FOL and100k level EOL）are the home of state-of-the-art machines that guarantee high quality manufacturing.
BIWIN insists on independent R&D and constant innovation. For years, we have been awarded China's High and New-Technology Enterprise and Shenzhen's High and New-Technology Enterprise achievements. We also possess ISO9001, QC080000 and ISO14001 certificates.
With long-term partnerships with Micron, Toshiba, Samsung and Intel, BIWIN has a powerful wafer supply chain. During the past 20 years, we have acquired lots of valuable customers from all over the world based on our reliable products and professional R&D capability.