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The embedded awards were presented once again at the traditional awards ceremony on 26 February 2019. For the 15th time, the coveted industry accolades recognised the most innovative development achievements in the traditional categories hardware, software and tools. For the first time this year, prizes were also awarded in the new categories embedded vision and start-ups. The awards were presented by Richard Krowoza, Member of the Management Board of NürnbergMesse and Professor Axel Sikora, chair of the jury and the advisory board of embedded world.
“We were impressed by the large number of highly innovative submissions by embedded systems developers in the various categories. Once again, the jury was spoilt for choice. However, we see this as evidence of the kind of innovative strength and dynamism in this sector. The award is a way of thanking and acknowledging the outstanding players from the embedded world,” says Professor Sikora.
Ultrahaptics wins in the category hardware with its ultra-haptic module “STRATOS Inspire”
The STRATOS Inspire enables users to feel haptic sensations in mid-air with their bare hands, without the need to wear or hold anything. This new sleek self-contained module is designed to be quickly and easily added to existing displays or integrated into VR and AR location-based experiences. Inside the box is an array of tiny ultrasonic speakers that are precisely controlled by the algorithms embedded within two key ICs (a microcontroller and FPGA). The algorithms control the timing and frequency of the ultrasound that they emit so that the pressure produced from multiple ultrasonic waves is concentrated in multiple points within the user’s reach. The unit includes a LEAP MOTION® camera module which tracks the user’s hands so that the haptic sensations can be applied directly to the palm or fingertips.
Hitex GmbH impresses with AURIX™ SafeTpack in the software category
The AURIX™ SafeTpack is a complete safety management solution for the second generation of Infineon’s AURIX safety microcontrollers. With its advanced features for connectivity, security and functional safety, the AURIX microcontroller family is ideally suited to a wide field of automotive and industrial safety applications. These AURIX devices contain Logic Built-In Self-Tests (LBIST) in addition to the lockstep technology of the cores. SafeTpack takes care of the functional safety of the microcontroller by managing AURIX’s complex LBIST and other safety features, freeing the developer to focus on the application. SafeTpack adds further advanced safety functions such as Program Flow Monitoring to ensure all safety relevant code has been executed or the cyclic control of peripherals. It coordinates the execution of startup and cyclic tests that ensure the correct operation of the CPU and internal buses. It also manages the watchdog system and an optional combined watchdog and power regulator (such as TLF3558). The modular framework of SafeTpack allows easy customisation and the addition of individual functions. SafeTpack can be used either with or without AUTOSAR.
GÖPEL electronic GmbH wins with ChipVORX SI in the tools category
To reduce the effort required for design validation and production testing for modern complex assemblies with high densities, ChipVORX-SI (Synthetic Instruments) was developed as an innovative technology for the automated use of existing FPGA as design-integrated test centres. It uses the native capabilities of the FPGA to configure so-called embedded instruments and to execute various test functions. These instruments, known as ChipVORX IP, are automatically generated by the user via a web interface using a cloud-supported synthesis process and later loaded and executed fully automatically into the FPGA. ChipVORX SI now allows the user to configure complex test instruments without much specialist knowledge and to use them automatically in their application.
Basler AG awarded first prize in the new category “Embedded Vision” with its dart BCON for MIPI Development Kit
Basler’s new Embedded Vision Kit includes the first camera module making use of the Image Signal Processor of Qualcomm’s Snapdragon SoC under Linux. This innovative product concept significantly reduces the overall processor load of the system and thus frees more computing power for the actual application. Basler’s new development kit provides a complete development platform for demanding embedded vision projects by combining high-performance embedded processing and CSI-2 interface technology with standards and features from the Machine Vision world. The dart BCON for MIPI Development Kit consists of a 5 MP, 60 fps dart camera module with BCON for MIPI interface and a processing board, equipped with a Qualcomm Snapdragon 820 SoC. A ready-to-go sample setup and Board Support Package including all required drivers offers the same integration convenience as with any plug and play camera interface, such as USB 3.0.
Wisebatt wins in the new category “Startup” with its simulation tool to optimise electronic designs
Wisebatt is a unique simulation tool for electronics engineers developing IoT devices. They can build virtual prototypes and collaborate to make the optimal choice between cost, battery life and performance, very early in the design cycle. Within a short time, hardware engineers access complex modelling results.
WISEBATT also offers a "Freemium" business model, which allows anyone to benefit from Wisebatt with public projects for free – similar to "Github". It will enhance collaboration on open-hardware projects and increase virality.
The 2019 jury comprises:
- Dr Erich Biermann
Bosch-Automobilelektronik, Robert Bosch GmbH
- Bertold Brackemeier
Senior Manager Public Relations, NürnbergMesse GmbH
- Professor Albert Heuberger
Fraunhofer Institute for Integrated Circuits IIS
- Joachim Kroll
Deputy Editor-in-Chief Elektronik magazine, WEKA Fachmedien GmbH
- Professor Roberto Oboe
Department of Technology and Management of Industrial Systems, University of Padua
- Professor Axel Sikora
Offenburg University, Chair of Jury
- Anne Wendel
Director Machine Vision, VDMA Robotics + Automation
For all information and tips on embedded world 2019 such as floor plans, detailed congress programmes, the latest exhibitor and product directory plus travel advice please go to: www.embedded-world.eu