Expert panels

Subject: Embedded AI
When: Monday, 1 March 2021, 15:30
Speaker:
Eddie Seymour - European Technical Director, NVIDIA, Oxford, UK
Dr. Jan Werth - Lead data scientist, Phytec Messtechnik GmbH, Mainz, Germany
Andrés Mlinar - Sr. Software Engineer at Azure RTOS, Microsoft, Munich, Germany
Moderator & Sherpa: Prof. Dr.-Ing. Axel Sikora - Offenburg University

Content / description:
Now in its 19th year, the annual motto of the embedded world Conference is embedded.intelligent.systems. Thus it takes up the title of one of its precursors from the 1990s. It Back then "Embedded Intelligence" was rather a vision of the future.

In the meantime, embedded intelligence is becoming more and more relevant and is shaping an increasing number of systems, from autonomous vehicles, image recognition and embedded vision to preventive and needs-based maintenance in Industry 4.0 applications, and from small embedded micro-controllers to high performance Cloud servers. These developments are opening up immense possibilities and business opportunities, but they are also closely associated with a host of technical, economic, social and ethical issues.

However, “Embedded Intelligence” is not all. We extended the focus in 2021 to “embedded.intelligent.systems”, as we see the embedded intelligence as one part in the overall picture of complex, distributed systems in and for the Industrial Internet of Things.
We want to discuss the importance of artificial and embedded intelligence today and in the future with these first-class panelists. We are going to need to talk about when AI and machine learning are useful and when they are not.

Subject: Safety and Security - still a challenge for small and medium sized projects?!
When: Tuesday, 2 March 2021, 15:30
Speaker:
Reinhard Keil - Senior Director of Embedded Tools at ARM
Jörg Stender - Managing Director of Hitex GmbH
Alessandro Bastoni – System Architect/Functional Safety Expert – STMicroelectronics
Prof. Fromm - Master Course Director, Beauftragter für das Kooperative Studium / KoSE

Content / description:
The focus of the embedded world 2021 Safe for the Future panel will be “Safety and Security - still a challenge for small and medium sized projects?!”. Whereas large companies, e.g. in the transportation or medical sector usually have internal expert teams, the design and development of safe applications for smaller companies remains a huge challenge, both technical and organizational.

It typically starts with the fundamental question – which safety standard is relevant for my project? And continues with complex decisions like the selection of the appropriate hardware, libraries, RTOS and tools. Is a safety ready chip sufficient or do we need a certified hardware? Which toolchain / operating system is the right choice? Which additional tools are required?

Once these questions are answered, the real work starts. How can we build the safety case? What needs to be considered when designing a safe hardware / software architecture? How do we qualify our solution? And what needs to be documented?

Together with the experts Reinhard Keil (Senior Director of Embedded Tools at ARM), Alessandro Bastoni (Functional Safety Expert at STMicroelectronics) and Jörg Stender (Managing Director at Hitex GmbH), Prof. Dr.-Ing. Peter Fromm (Member of the embedded world Conference Steering Board) will discuss these questions and will try to elaborate a path towards a safety case for small and medium sized projects.

Subject: Embedded Vision: success factors for generating customer value
When: Thursday, 4 March 2021, 10:15
Speaker:
Arndt Bake, Chief Marketing Officer, Basler AG
Olaf Munkelt, Managing Director, MVTec Software GmbH
Fredrik Nilsson, Head of Business Unit Machine Vision, SICK AG
Austin Ashe, Head of Strategic Partners and Channels, AIoT Devices, Amazon Web Services, Inc.
Moderator: Greg Blackmann, Editor in Chief, Imaging and Machine Vision Europe

Content / description:
Embedded vision is on the rise. Be it in factories, agriculture, or our households and everyday lives, many future applications will be based on embedded vision: small, integrated image processing systems that work intelligently directly from devices and enable them to see and understand.

Embedded vision is made possible by compact, high-performance computing platforms that consume very little energy and, thanks to standardized interfaces to image sensors, can process an increasing amount of image data in real time.

Where is the technology used today? What new promising applications are on the horizon? Why is it an attractive way of developing vision applications? What are the factors for success, and what are the barriers to entry? All this will be the subject of a panel discussion on the trend topic “Embedded Vision” at the embedded world 2021 DIGITAL, organized by VDMA Machine Vision and the embedded world 2021 DIGITAL.

Subject: Diversity Talks - How diverse teams drive innovation
When: Thursday, 4 March 2021, 14:20
Speaker:
Dr. Anna Maria Oberländer, Co-director of Kernkompetenzzentrum Finanz- & Informationsmanagement (FIM), Augsburg, Germany
Markus Zechel, Program and Innovation Manager, Analytics Translator, Siemens, Munich, Germany
Deepa Gautam-Nigge, Senior Director / Global Lead SAP Next-Gen Ecosystem, SAP, Munich, Germany
Angelika Huber-Strasser, Head of Corporates, KPMG Deutschland, Munich, Germany
Moderator: Magdalena Daxenberger, Marketing & Innovation Manager, DH electronics, Bergen, Germany

Content / description:

In times of digitalization, the competitive pressure in the electronics industry continues to increase. New technologies, such as artificial intelligence, face developers with all kinds of challenges and at the same time open up completely new opportunities. The requirements for new products are increasing, technical possibilities are becoming more complex and development cycles are becoming shorter. At the same time, development teams are expected to bring high-quality products to market that meet customer requirements as closely as possible. In order to meet these high demands, we have to leave behind existing ways of thinking and collaborating in order to break new ground. In this context, the connection between a heterogenous workforce and innovation success is increasingly coming into focus. Diverse teams have been proven to have a higher chance of innovation success, which can be attributed to the combination of different perspectives on an issue. Although the advantages of diverse teams are obvious, the reality is currently still quite different. In the context of the panel talk, different aspects of diversity will be discussed and opportunities for more diverse teams in everyday business will be highlighted.

Subject: Embedded Connectivity on IoT - Quo Vadis
When: Friday, 5 March 2021, 10:15
Speaker:
Dr. David McDonald, CEO, Danalto, Dublin Ireland
Dr. Holger Claussen, Head of Wireless Communications Lab, Tyndall National Institute, Ireland
Marie Hernes, Applications Manager, Texas Instruments, Norway
Anders Pettersson, Director of Field Marketing, Silicon Labs, Sweden
Moderator: Prof. Dirk Pesch, University College Cork, Ireland

Content / description:
There is a plethora of wireless connectivity solutions available for IoT, from the open to the proprietary to the standardised ones. Many industry alliances and standards bodies are driving the development of the many technologies but there seems little coordinated effort, leading to a fragmented technology space. Some technologies offer “native” IP connectivity offering true Internet of Things potential, whereas other network technologies provide data and access through cloud-based APIs. Interoperability, security, scalability, and manageability are all concerns that have not been put to rest yet. And then the arrival of 5G and its promise of ubiquitous connectivity services from mobile broadband to massive and critical machine type communications appears to have created expectations that may not always be fulfilled. This panel will discuss the latest developments in wireless connectivity solutions for IoT, will touch on a range of topics from interoperability to security and reliability and provide an outlook towards the future.

Track Kickoff with the Embedded Insiders // Wednesday, 3 March 2021, 18:30

Subject: Track Kickoff with the Embedded Insiders
When: Wednesday, 3 March 2021, 18:30
Speaker:
Rich Nass and Brandon Lewis, Embedded Computing Design

Content / description:
The Embedded Insiders will discuss the latest industry trends, what it means to have a virtual embedded world, and then take questions from the audience.

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Add Vision to Your IIoT System // Wednesday, 3 March 2021, 19:00

Subject: Add Vision to Your IIoT System
When: Wednesday, 3 March 2021, 19:00
Speaker:
Patrick Dietrich, Chief Technology Officer, Connect Tech

Content / description: tba

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Migrate Your Arm-based Design to 64-bits // Wednesday, 3 March 2021, 19:30

Subject: Migrate Your Arm-based Design to 64-bits
When: Wednesday, 3 March 2021, 19:30
Speaker:
Shawn Prestridge, US Field Applications Engineer Team Leader, IAR Systems

Content / description:
Many embedded applications are beginning to make the leap from 32-bit MCUs to 64-bit. Not only does this provide more addressable space for code and data, but newer parts are also more power-efficient than ever before. Is your application ready to make the jump? In this talk, we will discuss some of the key differences between 32-bit and 64-bit code and how to more easily make the transition. We will discuss differences in data models, structure packing, unbalanced unions, and more. Attendees will have a much better idea how to scan their existing codebase looking for potential pitfalls When they make the jump to 64-bit.

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Powering Next-Generation Industrial Motors // Wednesday, 3 March 2021, 20:00

Subject: Powering Next-Generation Industrial Motors
When: Wednesday, 3 March 2021, 20:00
Speaker:
TBD, Power Integrations, tba

Content / description: tba

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What 5G Brings to Edge Computing // Wednesday, 3 March 2021, 20:30

Subject: What 5G Brings to Edge Computing
When: Wednesday, 3 March 2021, 20:30
Speaker:
Robert Oshana, VP Software Engineering Research and Development, Microcontroller Group at NXP Semiconductors, Texas; USA

Content / description: tba

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AIoT Is Easier Than You Think// Wednesday, 3 March 2021, 21:00

Subject: AIoT Is Easier Than You Think
When: Wednesday, 3 March 2021, 21:00
Speaker:
Toby McClean, VP of AIoT Technology and Innovation, ADLINK Technology

Content / description:
The convergence of AI and IoT is driving innovation in industrial automation. While IoT and AI are established concepts When addressed separately, this session will discuss how AI technology can be integrated into IoT deployments to take automation to the next level. The session will also highlight computer vision use cases that are being used by customers today.

China and its role in the global semiconductor value chain // Tuesday, 2 March 2021, 08:00

Subject: China and its role in the global semiconductor value chain
When: Tuesday, 2 March 2021, 08:00
Speaker:
Michael Haidar, Global Vice President of Sales - Americas and EMEA at Gigadevice Semiconductor Inc.
Prof. Allan He, Xiaoqing, Deputy Director of the China Software Industry Embedded System Associations, Deputy Editor-in-Chief of the "Microcontrollers and Embedded Systems" Journal; China
Prof. Dr. JIAO Jiwei, Vice President of SIWAVE Inc. and professor of Shanghai Institute of Microsystem and Information Technology (SIMIT), Chinese Academy of Sciences (CAS), China
Moderator: Prof. Dr.-Ing. Axel Sikora, Offenburg University of Applied Sciences / Hahn-Schickard Institute Micro- & Information Technology, Offenburg, Germany
Iris Stroh, WEKA Fachmedien GmbH, Markt & Technik, Munich; Germany

Content / description:
Now in its 19th year, the embedded world becomes more and more international. And of course China is taking its share in the dynamic development.

In many industrial fields, China is not only the world’s largest single market and not only a production hub, but it is taking the technology lead. Recently, the German Chamber of Commerce in Greater China executed a poll amongst their 500 company members, which are companies having activities in China. And about 50 % of them believe that it is probable or highly probable that China will be technology leader in their domain.

On the other side, China had set itself the goal of manufacturing 40 % of the semiconductors consumed in China itself by 2020, and this share should rise to 70 % by 2025. Currently, “only 16 %” of the semiconductors consumed in China are also produced there, of which only about half are produced by Chinese semiconductor companies.

Also, there is an entity list that covers many areas, including equipment and tools, which might cause restrictions to the production capabilities.

However, there are strategic activities not only around production, but also around development for example for microcontrollers or for Programmable Logic Devices.

So, there is a lot of input parameters into a highly dynamic system.

For us, it is reason enough to discuss the status of Embedded Technologies and Economics in China and its Global Role.