Optimized for the embedded world, our cooling solutions address the specific requirements of IPC and embedded systems. Often, the goal is to efficiently dissipate hotspots. Heat spreading and heat conduction are necessary. Enclosures are directly used for cooling.
- AURORA - the brand new heatsink with NEOcore technology
- Heatsink with embedded heat pipes
- Heatsink with copper inlets
- Profile heatsinks and high-performance heatsinks
- Enclosures with cooling fins and heat pipe connections
- Pin-fin heatsinks
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