Franz Binder GmbH & Co. Elektrische Bauelemente KG

We offer

• Modules for Wired Communication
• M2M Modules
• Sensor and Test Modules
• Electromechanical Components
• Other Software Libraries
• PCB design
• Other Hardware Development
• Firmware and Driver Development
• Software Development for the IoT
• Application Development
• Software Development for HMI/Visualization
• Other Software Development
• Rapid Prototyping/Makers
• Other System Development
• PCB Assembly
• Electronic Manufacturing Services (EMS)
• Enclosure Manufacturing
• Module Assembly
• 3D Printing
• Testing Services
• Other Services