27 February - 1 March 2018 // Nuremberg, Germany

Exhibition Committee

embedded world Exhibition Committee

Thomas Bauch
PLS GmbH

embedded world Exhibition Committee

Jeffrey van Grunsven
AcQ Inducom

embedded world Exhibition Committee

Prof. Dr. Albert Heuberger
Fraunhofer-Institut für Integrierte Schaltungen IIS

embedded world Exhibition Committee

Frank Riemenschneider
DESIGN&ELEKTRONIK

embedded world Exhibition Committee

Holger Ruban
Conrad Electronic SE

embedded world Exhibition Committee

Christopher Smith
Green Hills Software

embedded world Exhibition Committee

Professor Dr.-Ing. Matthias Sturm
Head of exhibition committee embedded world, HTWK Leipzig (FH)

embedded world Exhibition Committee

Tyson Tuttle
Silicon Labs

embedded world Exhibition Committee

Michael Vierheilig
Intel GmbH

embedded world Exhibition Committee

Dr.-Ing. Thomas Wollinger
ESCRYPT GmbH

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