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2 - 4 March 2021 // Nuremberg, Germany

Conferences and supporting programme

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Presentations Exhibitor's Forum

The First Low ESR, Slim-profile, Reflowable Ultracapacitor Vortragssprache Englisch


FastCAP Ultracapacitors has developed the first low-ESR, thin-profile, reflowable ultracapacitor. This is a big step forward for ultracapacitors, as all board mountable ultracapacitors today need to be hand soldered, adding complexity and cost. The reflowability is a key feature that is possible thanks to our non-volatile electrolyte and a robust ceramic package. This is an ideal component for back-up power applications that require reliability at high temperature and a small footprint. Despite their low energy density, tantalum capacitors are preferred to EDLCs in back up power applications because EDLCs are unable to operate reliably at high temperature. Additionally, traditional EDLCs cannot be reflown. Nanoramic is now providing a component that has 10 times more energy density than a tantalum capacitor and can operate at temperatures greater than 70°C for years. This SD85-500 Chip Ultracapacitor has the highest energy density of any board-mountable ultracapacitor. The sealed ceramic package is pick and place compatible, RoHS compliant and Pb-free reflow compliant. The supercapacitor provides maintenance free storage in a small form factor, perfect for thin devices that require reliability and long lifetime at high temperatures (up to +85°C). This new technology is well suited for applications such as power loss protection for solid state drives, power buffering for lithium-ion batteries, and auxiliary power supplies for peak and pulsed power, wireless sensors, and energy harvesting. FastCAP is a known innovator in harsh environment ultracapacitors, and FastCAP’s products have provided trusted energy storage solutions for the energy exploration and aerospace industries. As a practical reflowable ultracapacitor, the FastCAP Chip Ultracapacitor makes ultracapacitors accessible to volume electronics manufacturing. Initial applications are solid state drives, but anything that requires volume manufacturing for applications in pulse power buffering is a potential market for this product. 

--- Date: 25.02.2020 Time: 15:30 - 16:00 Location: Exhibitor's Forum, Hall 3A, 3A-730


 Mitch Koffel

Mitch Koffel

Nanoramic Laboratories


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