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26 - 28 February 2019 // Nuremberg, Germany

Conferences and supporting programme

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Session 10.3: SoC III Complex ICs & System Solutions

High Performance Thermal Management Using Miniature Low Cost Microfluidics Heat Sink Vortragssprache Englisch

Despites the tremendous progresses made in the semiconductor industries in order to reduce Integrated Circuit (IC) power consumption yet at keeping ever increasing performance levels, there exist still a performance limitation that is due to the over heating of semiconductors components. This is particularly the case as the different dies are being placed closer and closer to another's : the dies themselves tends to be as small as possible to lower their unit cost and the components are getting packed together due to miniaturization reasons, this has the effect of concentrating heat sources in smaller and smaller volumes. Passive cooling techniques can bring some relief but there is a lack of solution for high heat flux removal. Liquid (e.g. water) is more effective in removing heat compared to air, because of its higher thermal conductivity and specific heat capacity. The use of small, parallel, high-aspect-ratio microchannel structure further increases the convective heat transfer surface area and the heat transfer coefficient, which enables high heat flux through the sink it-self. We are proposing to leverage semiconductor/MEMS fab capabilities to produce low cost heat sink made in silicon. The heat sink consists of single-phase liquid cooling flowing into micro-channels, that are realized with semiconductors patterning equipment. In the present study, we have been able to dissipate heat flux as high as 800W/cm² while maintaining the heat source die below 95°C.

--- Date: 28.02.2019 Time: 10:30 AM - 11:00 AM Location: Conference Counter NCC Ost

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