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26 - 28 February 2019 // Nuremberg, Germany

Conferences and supporting programme

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Presentations Exhibitor's Forum

GE rugged COM Express Modules Vortragssprache Englisch

GE’s rugged COM Express modules offer the ultimate in durability with a range of performance-per-watt levels. They are well-suited for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Onboard components are specifically selected for their reliability in demanding conditions. Unlike solutions designed for benign environments, our processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes.

--- Date: 27.02.2018 Time: 2:00 PM - 2:30 PM Location: Exhibitor's Forum hall 3A, stand 3A-610

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