+++ The entries in the exhibitor & product database correspond to the registration status for embedded world 2020. +++
Workstation-grade 9th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake) Fanless Embedded System, max 9 GigE LAN with 4 PoE+, 4 front-access SSD trays, max 2 PCIe Slot, 3 SIM, 6 USB 3.1, 4 COM RS-232/422/485, 32 Isolated DIO, high-performance, rugged, extended temperature
Key Features
- 8 Cores 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 (Coffee Lake) with Workstation-grade Intel® C246 chipset
- Fanless, -40°C to 75°C operating temperature
- Multiple USB 3.1 Gen 2, up to 10Gbps SuperSpeed data transfer
- Max 9 Independent GigE LAN with 4 IEEE 802.3at PoE+, optnioal supports 4 M12 PoE+
- 32 Isolated DIO, 6 USB 3.1, 4 COM RS-232/422/485
- Storage : 4 2.5" SSD trays, 1 CFast, 1 M.2, 4 SATA III
- Expansion : 2 PCIe, 2 Mini PCIe/mSATA, 1 M.2
- Multiple PCIe x16 expansion, up to 700W Power Budget
- 3 external SIM sockets for WiFi/4G/3G/LTE/GPRS/UMTS
- 6V to 36V DC Power Input with 80V Surge Protection
- Configurable Ignition Power Control