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2 - 4 March 2021 // Nuremberg, Germany

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Exhibitors & Products embedded world 2020
Zoom Image LOGO_Workstation-grade Fanless System

Workstation-grade Fanless System

LOGO_Workstation-grade Fanless System

Workstation-grade Fanless System

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Workstation-grade 9th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake) Fanless Embedded System, max 9 GigE LAN with 4 PoE+, 4 front-access SSD trays, max 2 PCIe Slot, 3 SIM, 6 USB 3.1, 4 COM RS-232/422/485, 32 Isolated DIO, high-performance, rugged, extended temperature

Key Features

  • 8 Cores 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 (Coffee Lake) with Workstation-grade Intel® C246 chipset
  • Fanless, -40°C to 75°C operating temperature
  • Multiple USB 3.1 Gen 2, up to 10Gbps SuperSpeed data transfer
  • Max 9 Independent GigE LAN with 4 IEEE 802.3at PoE+, optnioal supports 4 M12 PoE+
  • 32 Isolated DIO, 6 USB 3.1, 4 COM RS-232/422/485
  • Storage : 4 2.5" SSD trays, 1 CFast, 1 M.2, 4 SATA III
  • Expansion : 2 PCIe, 2 Mini PCIe/mSATA, 1 M.2
  • Multiple PCIe x16 expansion, up to 700W Power Budget
  • 3 external SIM sockets for WiFi/4G/3G/LTE/GPRS/UMTS
  • 6V to 36V DC Power Input with 80V Surge Protection
  • Configurable Ignition Power Control
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