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2 - 4 March 2021 // Nuremberg, Germany

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Exhibitors & Products embedded world 2020
Zoom Image LOGO_Sensry Ganymed®

Sensry Ganymed®

LOGO_Sensry Ganymed®

Sensry Ganymed®

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Revolutionized New Platform for All Integrated Smart & Secure Sensors

Next generation applications in logistics, robotics, automation, smart home and building, consumer and white goods, smart city and renewable energy require the adaption of smart and secure sensors with data connectivity. Existing semiconductor standard solutions often provide insufficient flexibility and missing software environment. The most critical item, however, is the missing inherent data security approach encompassing the complete value chain of the product.

The Solution

Sensry a newly established company offers an individual sensor node with highly flexible and customizable hardware configurations according to customer requirements. The universal sensor platform USeP combines cutting-edge assembly and packaging technologies with new design methods as well as various integration possibilities for sensors.

Main Product Features

  • Integration of various sensors
  • Support of multiple communication standards
  • Low power consumption
  • RISC-V performance for smart node computing
  • Adequate memory resources
  • Inherent multi-layer data security and authentication
  • Very fast design using standard library HW chiplets
  • Smallest form factor due to advanced packaging
  • Available software toolchain
  • Integration in fog, edge and cloud computing

Key features

  • Selection of Top-Level sensors
    • Acceleration
    • Gyroskope
    • Magnetometer
    • Vibration
    • Temperature
    • Pressure
    • Humidity
    • VOC
  • RF tranceiver on Bottom-Level
    • 2,4 GHz WiFi Tranceiver
    • 2,4 GHz Bluetooth Tranceiver
  • Application processor on Mid-Level
    • RISC-based multicore, running at max. 400MHz
    • RISCY Data acquisition Unit (DAQU)
    • 8 RISCY Data Proc. Units (DPU) with FPU
    • Event bus
    • DMA
  • Security features
    • Crypto Co-Processor
    • Secure Boot ROM
    • Secure MRAM / SRAM
    • True Random Number Generator (TRNG)
    • One-Time-Programmable Memory (OTP) for Keys and Certificates
  • Interfaces (Mid-to-Top, Mid-to-Bottom-Level)
    • 1 HyperBus (for external RAM/Flash)
    • 3 UART (up to 2Mbit/s, two of them with hardware handshake)
    • 4 I2C (up to 400kHz)
    • 4 I2S
    • 7 SPI (up to 50MHz)
    • 1 CAN-FD
    • 1 RGMII with MDIO for Ethernet-Phy
    • Debug JTAG | System JTAG
    • 1 25MS/s 12bit SAR ADC
    • 1 100kS/s 11bit ultra low power SAR ADC
    • 1 16Bit Sigma Delta ADC (Audio)
    • 32 GPIO (configurable for 1.8V or 3.3V operation)
    • Each interface (except GPIO) can be induvidually disabled for power saving
  • Memory
    • 512kB MRAM (256kB Secure MRAM + 256kB MRAM)
    • 4MB SRAM
    • 256kB SRAM for each core in the DPU (Tightly coupled

Applications

  • Sensor node for Internet of Things (IoT)
    • Home automation
    • Sensor networks
    • Building automation
    • Condition monitoring
    • Retro Fitting
    • Industrial applications
    • AI related applications
  • Authentication and security devices
    • Identification key
    • Secure sensor data harvester
    • Secure blockchain wallet
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