Our aim is to offer the most comprehensive implementation options possible, reflecting a wide range of customer market places, applications and individual requirements.
Reflecting this approach is our ability to offer much more than basic silicon design. To help achieve a finished and fully working chip we can also incorporate detailed implementation plans. These allow our customers to realise a complete chip solution based on selected packaging technologies and test methodologies.
Our customers are always looking for innovative packaging solutions. Twenty-five years of chip design projects has seen us develop experience in a wide range of package technologies. In addition to supporting standard package types we also offer a number of development packages for first silicon evaluation.
To help customers achieve a full silicon solution that they can use for sample purposes, as well as volume production, we offer various levels of test development. For basic implementation we provide a bring up service which gives customers a device that is fully functioning and tested.