2 - 4 March 2021 // Nuremberg, Germany
MeigSmart SLM758 series core board, the main chip is Qualcomm Snapdragon 600 series MSM8953, the CPU is made of 14nm FinFET, built-in 64bit ARM, 8-core Cortex A-53, clocked 2.0G processor, support LPDDR3 SDRAM memory .
Supports board memory of 16GB/32GB global different mode multi-mode LTE intelligent communication module, this module is suitable for TD-LTE/FDD-LTE/WCDMA/EVDO/TD-SCDMA/CDMA/GSM network standard broadband intelligent wireless Communication module. The SLM758 uses the Android 7.1 operating system and supports access rates:
TD-LTE: 117/30Mbps
FDD-LTE: 150Mbps/50Mbps
WCDMA up to DC HSPA+: 42Mbps/5.76Mbps
EVDO up to EVDO RevA: 3.1Mbps/1.8Mbps
TD-SCDMA up to HSPA: 4.2Mbps/2.2Mbps
CDMA1x: 153.6kbps/153.6kbps
GSM up to EDGE: 236.8kbps / 236.8kbps
The SLM758 provides high-speed broadband data access while providing voice, SMS, address book, WiFi, BT and GPS functions. The product supports dual 1300W 3D camera or depth of field camera, which can be widely used in law enforcement, police, POS Cash registers, logistics terminals, VR Camera, intelligent robots, video surveillance, security, in-vehicle equipment, intelligent platform handheld terminals and other products.Size: min. 350 x 350 px, max. 1500 x 1500 px
Size: 41.0×45.5×3.0mm LCC 160pin+LGA 112pin
Price：$ 55
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Smart Module SLM758 is assigned to following product groups:
embedded world
