Thin-film substrates are used where conventional PCB technologies cannot provide an adequate technical solution. Rigid and flexible multilayer circuits with highest resolution (10 μm) are possible. Thin-film technology uses semiconductor and microsystem technologies to produce circuit carriers on ceramic or organic materials. Interconnection carriers (substrates)
in thin-film technology enable extreme connection densities, high-precision geometries of conductors and insulator materials and high thermal conductivity, while offering maximum reliability.
Thin-film technology is impressive in terms of the usability, for example, of ceramic or quartz glass as a substrate material, and the high structural fidelity that can be achieved with tolerances up to ± 2 μm for the track width. Cable lines in thick-film technology are installed in the screen printing process and then burned in. The use of ceramic as a substrate ensures maximum reliability even under the hardest environmental conditions. A thick-film circuit is far better than a standard printed circuit board in terms of temperature resistance and life cycle.
- Rigid Thin-film substrates
- Flexible Thin-film substrates
- Thick-film substrates