This website uses cookies to make the content more user-friendly and effective. By using this website, you agree to the use of cookies. You can find additonal information about the use of cookies and the possibility of objecting to the use of cookies here.

25 - 27 February 2020 // Nuremberg, Germany

Posting print layout

What information should be shown in the print layout?

Create print layout
Exhibitors & Products embedded world 2020
Zoom product LOGO_WAFER-ULT3 / ULT4 – 3.5” CPU Board with Intel® Skylake/ Kaby Lake SoC

WAFER-ULT3 / ULT4 – 3.5” CPU Board with Intel® Skylake/ Kaby Lake SoC

LOGO_WAFER-ULT3 / ULT4 – 3.5” CPU Board with Intel® Skylake/ Kaby Lake SoC

WAFER-ULT3 / ULT4 – 3.5” CPU Board with Intel® Skylake/ Kaby Lake SoC

Request information Request information

Contact us

Please enter your personal information and desired appointment. You can also leave us a message.

Your personal information

Your message for us

Desired appointment during the exhibition

* Compulsory fields you must fill in.

Information on data protection can be found here.

Your message has been sent.

You do not have a registration yet? Register now and use all advantages of the Exhibitors and Products Database, the supporting programme and the TicketShop.

An error has occurred.


  • 3.5” CPU Board with combined cooling and mounting plate
  • Intel® 6./7. Generation i7/i5/i3 or Celeron® processor
  • Max. 8GB DDR4 SO-DIMM memory and 8GB on-board memory (optional)
  • USB, COM ports, SATA 6Gb/s, dual PCIe GbE
  • Expansions: Two Full-size PCIe Mini card slots with mSATA support or on-board SIM holder
  • Triple independent displays: HDMI (4K UHD), LVDS und internal DisplayPort
  • Power input: 12VDC
  • Operating temperature: -20°C~+60°C


  • Embedded PC & display solutions

Benefit from more performance and intelligent integration

System integrators and users of embedded PCs and display solutions will soon benefit from the new version of the proven WAFER-ULT series from ICP Deutschland. More performance with low waste heat and a wide selection of Intel® Skylake and Kaby Lake processors are the main advantages of the 3.5" CPU board.
The performance of the new Intel® platforms for CPU and graphics has increased by over 10% and 30%, respectively. With a maximum waste heat of 15W TDP of the various Intel® i7 / i5 / i3 or Celeron® processors, users are spoilt for choice. Particularly striking is the ingenious integration of the cooling and mounting plate of the WAFER-ULT3 / ULT4. The special design of the mainboard allows the waste heat of soldered SoC, on the bottom of the board, to be discharged effectively and directly to the outside. In this way, particularly slim embedded systems can be implemented. Up to three independent displays can be connected for embedded display solutions. This is made possible by an HDMI (4K UHD resolution) and an LVDS interface as well as an internal DisplayPort (iDP). Via an optional adapter the iDP can be converted to HDMI or DP. The two PCIe Mini card slots can be used for expansions around WLAN, 3G / 4G or industrial mSATA modules. At the customer's request, ICP Deutschland also integrates an on-board 8GB DDR4 SO-DIMM memory and provides the WAFER-ULT3 / ULT4 as a Ready-to-Use system.


The selected entry has been placed in your favourites!

If you register you can save your favourites permanently and access all entries even when underway – via laptop or tablet.

You can register an account here to save your settings in the Exhibitors and Products Database and as well as in the Supporting Programme.The registration is not for the TicketShop and ExhibitorShop.

Register now

Your advantages at a glance:

  • Advantage Save your favourites permanently. Use the instant access – mobile too, anytime and anywhere – incl. memo function.
  • Advantage The optional newsletter gives you regular up-to-date information about new exhibitors and products – matched to your interests.
  • Advantage Call up your favourites mobile too! Simply log in and access them at anytime.