Reliable through-hole plating is key to the success of the challenging PCB prototyping process. The LPKF Contac S4 unites various galvanic and chemical processes in the smallest space.
An integrated touch panel with wizard and parameter administration safely guides even inexperienced users through the galvanization process. The intuitive control allows developers to customize their own settings.
Despite its small footprint, the LPKF Contac S4 masters sophisticated processes for uniform copper coating. Anode plates made to fit the bath and reverse pulse plating ensure homogeneous deposition; carbon activation in accordance with the black hole method, optimized air injection and the Via Cleaner processing step eliminate unwanted separating layers. This results in uniform layer strengths in the holes and across the flat metal coating of the entire substrate.
It therefore pairs up perfectly with the LPKF ProtoLaser S4: this laser system, with a wave length in the green light spectrum, can structure through-hole plated boards without any problems.