+++ The entries in the exhibitor & product database correspond to the registration status for embedded world 2020. +++
Cadence Sigrity™ PowerSI®, Speed2000™, and OptimizePI™ and SystemSI™ tools
Preventing EMC problems in package and PCB board designs with analysis tools
EMC compliance is required by all commercial electronic devices to ensure safety, compatibility, and reliable operation. This demo shows you how to include EMC simulations and analysis early in the design stage to help avoid costly redesigns. The demo will utilize Sigrity™ PowerSI®, Speed2000™, and OptimizePI™ tools to show how SI/PI analysis supports EMC analysis and use postprocessing steps to identify radiated emissions.
Identifing IR drop and thermal problems in package and PCB board designs
The demand for thinner, faster, smarter, and higher performance electronics has created new challenges in thermal management. As the form factor shrinks, power consumption is not reducing proportionally, thus increasing the power density and heat that must be accurately modeled throughout the system. Electrical-Thermal (E/T) co-simulation plays a much greater role due to the advanced process ICs used in these systems with their lower voltage margins. This demo shows you how to utilize Sigrity PowerDC integrated electrical-thermal co-simulation to confirm your design has met specified voltage drop and temperature margins.
Simulating and verifying your Automotive Ethernet interface is standards compliant
As data rates for communication and serial link interfaces increases, device modeling, interconnect modeling, and analysis methodologies must continue to evolve to address the shrinking design margins and increasingly challenging compliance criteria facing today’s engineers. In this demo, we will show you how to use the Sigrity PowerSI, OptimizePI and SystemSI™ tools to simulate an Automotive Ethernet system with a channel model and verify the interface is standards compliant.