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25 - 27 February 2020 // Nuremberg, Germany

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Exhibitors & Products embedded world 2020
Zoom product LOGO_Snapdragon mobile platforms power next-generation mobile experiences

Snapdragon mobile platforms power next-generation mobile experiences

LOGO_Snapdragon mobile platforms power next-generation mobile experiences

Snapdragon mobile platforms power next-generation mobile experiences

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Next-generation processing and AI technologies with various platforms that integrate powerful hardware, connectivity, and software optimized for your end-application.
Planegg, December 6th, 2018
Atlantik Elektronik, provider of innovative embedded solutions, will present at the embedded world in Nuremberg, in hall 3, booth 141 Qualcomm® Snapdragon™ Mobile Platforms.
Inside every gorgeous mobile device lies the heart of a dragon. Qualcomm® Snapdragon™ Mobile Platforms, processors, modems and chipsets are as smart as they are powerful, with new architectures for AI and immersion. The Snapdragon Mobile Platform is designed to be your ultimate personal assistant, deliver cinema-grade videos and help protect your most precious data. All with extended battery life, so you can keep up with what’s important.


The Snapdragon Platforms includes new camera and graphics architectures that are designed to capture 64x more color information while transforming eXtended Reality (XR) with wall- and object-sensing technology. So now users can capture video in cinema-like quality, even in low-light conditions. Or immerse themselves in an XR experience that places them in the front seat of visual brilliance. With vivid graphics, crystal-clear audio and improved area awareness, our premium Snapdragon Platforms blurs the lines between the physical and virtual worlds

Quick Charge

Snapdragon platforms are redesigned to deliver high-performance experiences that won’t unnecessarily drain your device. The  power-efficient architectures help reduce power consumption across premium video capture and immersive computing tasks, giving you more time in your favorite world, whether it’s real or virtual. And even when that battery icon gets in the red, you can get back in the game quickly thanks to Qualcomm Quick Charge™ 4+ Technology, which boosts your device to 50% in just 15 minutes.


We help customers to build their wanted intelligent world easily with the Qualcomm Neural Processing SDK for Artificial Intelligence.
Premium tier Qualcomm® Snapdragon™ platforms have extensive heterogeneous computing capabilities that are engineered to allow the running of trained neural networks on device without a need for connection to the cloud. The Qualcomm® Neural Processing SDK for artificial intelligence (AI) is designed to help developers run one or more neural network models trained in Caffe/Caffe2, ONNX, or TensorFlow on Snapdragon mobile platforms, whether that is the CPU, GPU or DSP.
The Qualcomm Neural Processing SDK does a lot of the heavy lifting needed to run neural networks on Snapdragon mobile platforms, which can help provide developers with more time and resources to focus on building new and innovative user experiences.
3D Time of Flight (ToF) Imaging
One of the key challenges when developing AI applications is integrating sensors that can sufficiently replicate human senses. The 3D ToF Camera Cube Eye, available from Atlantik Elektronik, provides a 3D image stream, which can be used in robotics and other AI systems to make a precise visual evaluation of the environment, taking up the role of the human eye. This technology can be used to accurately measure the size and volume of objects and their relative position in real time.
They key advantage of the Cube Eye solution is that the sensor, optics and electronics are available as a complete package. Interface via USB means that minimal hardware integration is required. Application software development is supported by SDKs and APIs available for both Windows and Linux environments, with Android coming soon. Cube Eye is the perfect 3D vision solution for Snapdragon AI development.
The responsible person at Atlantik both 141 in Hall 3 is Mr. Dominik Bohn (Field Application Engineer).


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