This website uses cookies to make the content more user-friendly and effective. By using this website, you agree to the use of cookies. You can find additonal information about the use of cookies and the possibility of objecting to the use of cookies here.

25 - 27 February 2020 // Nuremberg, Germany

Posting print layout

What information should be shown in the print layout?

Create print layout
Exhibitors & Products embedded world 2020
Zoom product LOGO_VIA QSM-8Q60 Qseven™ Module

VIA QSM-8Q60 Qseven™ Module

LOGO_VIA QSM-8Q60 Qseven™ Module

VIA QSM-8Q60 Qseven™ Module

Request information Request information

Contact us

Please enter your personal information and desired appointment. You can also leave us a message.

Your personal information

Your message for us

Desired appointment during the exhibition

* Compulsory fields you must fill in.

Information on data protection can be found here.

Your message has been sent.

You do not have a registration yet? Register now and use all advantages of the Exhibitors and Products Database, the supporting programme and the TicketShop.

An error has occurred.

• Ultra compact 70mm x 70mm Qseven™ (2.0) form factor

• 1.0GHz Freescale™ i.MX 6DualLite Cortex-A9 SoC

• Wide operating temperature range from -20°C ~ 70°C

• 7 year longevity support

• Evaluation carrier board available

The VIA QSM-8Q60 is an ARM-based Qseven™ form factor module powered by a 1.0GHz Freescale™ i.MX 6DualLite Cortex-A9 SoC that delivers high performance and rich multimedia features in an ultra-compact package for a wide range of embedded system applications such as industrial automation, transportation, medical and infotainment.


The VIA QSM-8Q60 measures 70mm x 70mm and is fully compliant with the Qseven™ Rev. 2.0 embedded form factor standard adopted by the Standardization Group for Embedded Technologies e.V. (SGeT). Supporting a wide operating temperature of -20°C ~70°C, the VIA QSM-8Q60 is designed for optimum flexibility in the harshest environments.

Featuring an on-board Micro SD card slot, 4GB eMMC Flash memory and 2GB DDR3-10666 SDRAM, the module also offers rich I/O and display expansion options including 4 USB 2.0 ports, one HDMI port, one dual-channel 18/24-bit LVDS panel, 3 COM ports, Gigabit Ethernet, 2 CAN bus and PCIe x1.


The VIA QSM-8Q60 features a Linux BSP which includes the kernel (3.10.53) and bootloader source codes. Other features include a Tool Chain to help make adjustments to the kernel and to support the VIA QSMBD2 carrier board I/O and other hardware features.

A full set of software customization services that speed up time to market and minimize development costs are also available.


Customers can take advantage of our multi-I/O evaluation carrier board or can utilize VIA’s extensive technical support in developing a custom baseboard.


The selected entry has been placed in your favourites!

If you register you can save your favourites permanently and access all entries even when underway – via laptop or tablet.

You can register an account here to save your settings in the Exhibitors and Products Database and as well as in the Supporting Programme.The registration is not for the TicketShop and ExhibitorShop.

Register now

Your advantages at a glance:

  • Advantage Save your favourites permanently. Use the instant access – mobile too, anytime and anywhere – incl. memo function.
  • Advantage The optional newsletter gives you regular up-to-date information about new exhibitors and products – matched to your interests.
  • Advantage Call up your favourites mobile too! Simply log in and access them at anytime.