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2 - 4 March 2021 // Nuremberg, Germany

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Exhibitors & Products embedded world 2020
Zoom Image LOGO_nVent SCHROFF Interscale case platform for Industrial IoT applications

nVent SCHROFF Interscale case platform for Industrial IoT applications

LOGO_nVent SCHROFF Interscale case platform for Industrial IoT applications

nVent SCHROFF Interscale case platform for Industrial IoT applications

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nVent SCHROFF introduces a new concept for building embedded systems. Based on small form factor-boards (e.g. ATX, Micro ATX, Mini ITX, Pico ITX), single-board computers (e.g. Embedded NUC™, Raspberry Pi and Arduino) or a proprietary board, the customer first configures a case with the flexible and modular nVent SCHROFF Interscale case platform. Various electronic components, such as cooling, necessary cutouts, labeling and accessories are then integrated. Other services, such as performing simulations and tests, as well as certification support, are also included. As an example, by using standardized modules, the customer can build up custom IIoT solutions and other applications while keeping costs at a minimum.

Here, it isn't important which type of board the customer has selected for their application, whether standard or non-standardized. The nVent SCHROFF Interscale platform is flexible and can be adapted whether for standard or non-standardized boards. This case platform is based on a parametric model, and can easily be adapted to various heights, widths and depths, depending on requirement and the size of the respective board. The special interlocking design of nVent SCHROFF Interscale cases provides integrated EMC protection of 20 dB at 2 GHz without requiring additional EMC seals. The design ensures a protection class up to IP 30. Depending on the model, the cases consist of either two to four parts that are easily fastened by the use of only two or four screws. The cases can be assembled and taken apart quickly and easily, which greatly reduces integration time. Based on the board type selected, specific interfaces are preconfigured into the case cutouts.. These and other individualized cutouts specified by the customer are a part of the overall Interscale concept.

Afterwards, further electrical components are integrated, such as a power supply or PCI-/ PCIe card installation options and hard-drive mounts, and a suitable cooling solution can be selected. Depending on thermal power loss, various options are available. In some systems, power loss is so low that no cooling is necessary. If thermal power loss increases, nVent SCHROFF Interscale cases can be equipped with perforations and optional fan kits that allow for a variably controlled air stream. Heat is dissipated alternately through conduction cooling using integrated heat sinks and/or flexible heat conductors (FHCs). With the additional installation of the FHC, developed by nVent, made from aluminum and available in various geometries, conduction cooling performance can be further improved so that a wide spectrum of application needs can be met.. Processors of various thicknesses can remain permanently in contact with the FHC while maintaining a constant contact area because the FHC is innovatively designed to provide tolerance compensation. No additional thermal pad is required.

A wide range of powder coating and printing options are available for individualizing the configured system. With this, customers have the option of choosing case color and to include design elements and multi-color logos up to photo-realistic images according to their design needs. Useful accessories, such as plastic supporting feet for use as a desktop case or clips for horizontal rails with lips, complete the configuration. Additionally, customers can leverage further services such as the implementation of simulations and tests or receiving support for certification.


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