+++ The entries in the exhibitor & product database correspond to the registration status for embedded world 2020. +++
Heneng Technology is a professional Turn-Key EMS (Electronic Manufacturing Service) provider focusing on PCB & PCBA solutions for international markets.
Heneng Technology is headquatered in Shenzhen, China with clients from all over the world, such as Russia, United States, UAE, Europe, Asia etc. We provide the most suitable service and solutions to clients from various fields, such as Robotics, Bio-medical, Automation, Tele-communication, Commercial Drones, Home Appliances, and more.
Our mission is to help clients reach their goals by providing them the best products with best quality and price in the best time.
Our Turn-Key solutions include PCB Manufacturing, Electronic Components Procurement, PCB Assembly, Engineering Assistance, Box-Build, QA and Logistics Service. We have an experienced, talented and dedicated team with an extensive background in the fields of PCB Design & Manufacturing, Project Management, Supply Chain Management, etc. We respond to opportunities, assess challenges and develop solutions while leveraging our relationships and expertise.
Current products manufacrured include backplanes, HDI boards, High TG boards, High Fequency boards, Flex and Rigid Flex boards, and more.
PCB Production Capabilities
- Layers: Up to 42
- Min Line width/spacing(mil) for inner layers: 3.0/3.0
- Min Line width/spacing(mil) for outer layers: 4.0/4.0
- Copper weight: 0.5 – 6.0 OZ
- Max Aspect Ratio: 11:1
- Board thickness: 0.2mm-8.0mm
- Max Panel size: 18″ * 24″
- Min Hole diameter(mil):4
- Material: FR-4, High Tg FR-4, Halogen free, High Frequcncy, ( Rogers, Arlon, Taconic, Nelco…)etc.
- Surface Treatment: HASL, ENlG, lmmersion Silver, lmmersion Tin, Lead free HASL, etc.
- Impedance Control: +/-10%
SMT Production Capabilities
- Max PCB size: 490 x 420 mm
- Min PCB size: 45x45 mm
- Board thickness: 0.4-5 mm
- Min Components size: 0201-01005
- Component max height: 25 mm
- Min lead pitch: 0.35 mm
- Min BGA ball pitch: 0.4 mm
- Placement precision: +/- 0.03mm
- Laser cut for Stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um
Many clients and businesses keep coming to Heneng Technology since they confidently know that our company provides the insight, knowledge, professional guidance and end-to-end services that helps them move forward with their goals. On top of these all, the company delivers pragmatic and professional solutions in order to provide fast and practical results. Our commitment to quality includes executive oversight in every engagement with unparalleled attentiveness to the relationship we forge with each of our clients.
Browse our website (www.henengpcb.com) for more information.