Keith & Koep GmbH

Touch panel computer with Myon or Trizeps CPU module technology

The i-PAN M7 and i-PAN T7 are fully equipped ARM touch panel computers based on Myon or Trizeps CPU modules. The CPU module technology allows easy upgrading to new processor generations..

Due to the compact dimensions, the i-PAN touch panels can be integrated into existing housings and functionally expanded.

Depending on the version, Microsoft Windows 10 IoT Core, Windows CE, Embedded Compact 7, 2013 as well as Linux and Android operating systems are available.

The industrial panels have a 7.0 inch multi-touch TFT display, which is designed for professional use and can also be used outdoors in daylight thanks to its high brightness of 850 cd/qm and anti-reflective surface. The resolution is 800 x 480 px.

Depending on the version, Ethernet, USB2.0 Host, μUSB2.0 OTG are available as interfaces. In addition, the devices are equipped with a μSD card socket, a 3.5 mm headset jack for microphone and headphones, a real-time clock with backup battery as well as power failure detection.

With the i-MOD extension boards I2C, UART, CAN, camera and battery interfaces can be connected. SPI and audio interfaces are provided via solder contacts. Power can be supplied via POE (Power Over Ethernet), 12/24 VDC or a battery.

Due to its rich and practical features, the i-PAN M7 / T7 touch panels can be used in a wide range of industries, including manufacturing, medical, automotive, aviation, retail and gastronomy sector.

Micro CPU module with NXP i.MX 8M Mini

With its compact dimensions and low power consumption, the Myon II CPU module is the ideal solution for handheld and IoT devices. The Myon II uses the NXP i.MX 8M mini processor, which integrates a Cortex M4 processor for low-power applications.

The NXP i.MX 8M Mini processor is produced in 14nm LPC FinFET technology, which enables high operating frequencies with low power consumption. Therefore, the Myon II SOM fulfils high performance requirements for current video, speech and audio processing, including video resolutions up to 1080p.

Available with Linux, Android and Microsoft Windows IoT Core operating systems

• NXP i.MX 8M Mini CPU up to 1.8 GHz (consumer), 1.6 GHz (industrial), with integrated Cortex M4
• Up to 8 GByte LPDDR4-3200 RAM, 32 Bit
• 2 additional SD cards can be connected externally
• GBit Ethernet (via RGMII, PCIe and USB interfaces), USB 2.0
• Supports MIPI Displays and Cameras
• LVDS Transceiver
• Pin compatible to Myon I CPU module

Constantly high quality through multi-stage test of each individual CPU module

To ensure a constantly high quality, each individual CPU module is passed through a multi-stage test. The test result covers 100% of all interfaces.

• AOI/MOI: Multiple automatic and manual optical control of each CPU module during the production.
• JTAG/Boundary Scan Test: JTAG/Boundary Scan Test: The signal of each pin which is accessible via the JTAG chain is checked for connection, shorts, missing pull-up/down resistors. The DDR Ram is tested for row/column pin assignment..

Functional tests of high-speed and analog interfaces (Ethernet, display, USB, audio, etc.) which are not testable via JTAG.

High-performance i.MX6 CPU module with compact dimensions

The Trizeps VII is one of the world‘s most powerful NXP i.MX6 CPU modules and is suitable for multimedia, multitouch and multidisplay applications as well as for demanding control tasks. It uses the full performance potential of the NXP i.MX6 processor with the compact form factor of the SODIMM 200 standard.

Available with Microsoft Windows 10 IoT Core, Windows Embedded Compact 7, 2013, Linux and Android operating systems

• Trizeps SODIMM-200 compatible
• Same form factor for Solo-, DualLite-, Dual- and Quad-Core versions
• Additional highspeed-functions with the new board-to-board connector
• Dual antenna +18dBm WiFi / BT
• Audio codec and ethernet transceiver
• 64 Bit RAM

Constantly high quality through multi-stage test of each individual CPU module

To ensure a constantly high quality, each individual CPU module is passed through a multi-stage test. The test result covers 100% of all interfaces.

• AOI/MOI: Multiple automatic and manual optical control of each CPU module during the production.
• JTAG/Boundary Scan Test: JTAG/Boundary Scan Test: The signal of each pin which is accessible via the JTAG chain is checked for connection, shorts, missing pull-up/down resistors. The DDR Ram is tested for row/column pin assignment.
• Functional tests of high-speed and analog interfaces (Ethernet, display, USB, audio, etc.) which are not testable via JTAG

SODIMM Standard

The Trizeps VII includes the Keith & Koep SODIMM 200 Standard, the world‘s longest existing SODIMM standard. Like no other module standard, the SODIMM 200 ensures the pin compatibility of the Trizeps modules.

CPU Module with NXP i.MX 8M Mini processor

The new Trizeps VIII Mini CPU Module from the NXP i.MX8 series uses the i.MX 8M Mini processor, which provides the high performance demands of current video, voice, and audio processing, including video resolutions up to 1080p. The NXP iMX8M Mini CPU is produced in the 14nm LPC FinFET technology, which enables high operating frequencies in combination with a low power consumption.

The Trizeps VIII Mini adds further features with the configurable FPGA, the programmable NXP Kinetis Cortex M0+ MCU, the LVDS transceiver, the Hi-Fi Audio Codec and the onboard WLAN/Bluetooth module. This integrates e.g. CAN, ADC, SPI, I2C interfaces as well as RBG and LVDS displays in addition to the iMX8M Mini CPU functionality.

Therefore, the Trizeps VIII Mini is the ideal CPU module for typical embedded solutions such as industrial-/ home automation, robotics, automotive, medical, aerospace, retail and is also ideally suitable for current streaming, audio applications, modern imaging devices or handhelds as well as battery-powered solutions.

Available with Linux, Android and Windows 10 IoT Core operating systems.

Constantly high quality through multi-stage test of each individual CPU module

To ensure a constantly high quality, each individual CPU module is passed through a multi-stage test. The test result covers 100% of all interfaces.

• AOI/MOI: Multiple automatic and manual optical control of each CPU module during the production.
• JTAG/Boundary Scan Test: JTAG/Boundary Scan Test: The signal of each pin which is accessible via the JTAG chain is checked for connection, shorts, missing pull-up/down resistors. The DDR Ram is tested for row/column pin assignment.
• Functional tests of high-speed and analog interfaces (Ethernet, display, USB, audio, etc.) which are not testable via JTAG

SODIMM Standard

The Trizeps VIII Mini features the Keith & Koep SODIMM 200 Standard, the world‘s longest existing SODIMM standard. Like no other module standard, the SODIMM 200 ensures the pin compatibility of the Trizeps modules. The main difference of the Trizeps VIII Mini is the missing address/data bus, which is no longer supported by the i.MX 8M Mini CPU. The pins, which are no longer needed for this function, are used for GBit Ethernet signals. Trizeps VIII Mini and Trizeps VIII are mostly pin compatible.