Cicor Group Cicor Management AG

For over 50 years, Cicor has been developing and producing sophisticated flexible, rigid-flexible and rigid printed circuit boards (PCBs), from the idea, through prototypes, to large-series production. Thanks to a comprehensive expertise in multilayer boards (MLBs), multi-chip modules (MCMs), high-density interconnects (HDIs) and reel-to-reel technology, Cicor develops innovative and reliable solutions for demanding applications in medical, aerospace and defence, automotive and transport, communication, industrial, watches and consumer markets.

Thin materials and line width and spacing down to 25 μm enable extreme miniaturization and ultra-HDI advanced solutions. The new DenciTec® technology opens up completely new  possibilities. Innovative circuits can be produced by combining PCB processes with thin-film technology.

Portfolio

• Flexible PCB
• Rigid-flexible PCB
• Rigid PCB
• DenciTec®
• 3D-MID

In the first quarter of 2019, Cicor opened a technology center for printed electronics at the Bronschhofen site in Switzerland and will invest around CHF 1.5 million in further expansion over the next two years. Within the technology center, a team of application engineers take care of application development.

The increasing number of electronic devices in more and more applications requires new manufacturing technologies to be developed and industrialized. Flexible additive manufacturing processes play a key role in substrate manufacturing and connection technology.

The unique printing technology used, enables a wide range of conductive, non-conductive and biocompatible materials to be printed on a wide range of substrates and forms. In addition, new opportunities exist for interconnect technologies that can lead to performance improvements and cost optimization.
The integration of the circuits into three-dimensional surfaces often eliminates the need to use an additional substrate. Compared to the methods used today to produce such three-dimensional circuit carriers, the technology chosen by Cicor offers a significantly wider variety of printed and printable materials. Devices for medical, aerospace and IoT applications can be significantly reduced in size by using this technology.

With the opening of a technology center for printed electronics in Bronschhofen, Cicor is underlining its ambition to become the technology leader and its claim to be able to offer customers new, innovative solutions in addition to proven technologies. 
 

Portfolio

Technical capabilities

• Lines/spaces down to 10 μm
• Printing thickness from < 100 nm to tens of μm
• Large material portfolio (conductive, non-conductive, resistors, biocompatible, photoresist, etc.)
• Printing on standard materials
• Efficient printing process

Possible applications

• Printed flex and rigid circuits
• Printed embedded passives
• Printed circuits on ceramics (2D + 3D)
• Printed circuits on plastics
• Biocompatible circuits
• Die stacking

For additional applications please contact our engineering department

Thin-film substrates are used where conventional PCB technologies cannot provide an adequate technical solution. Rigid and flexible multilayer circuits with highest resolution (10 μm) are possible. Thin-film technology uses semiconductor and microsystem technologies to produce circuit carriers on ceramic or organic materials. Interconnection carriers (substrates)
in thin-film technology enable extreme connection densities, high-precision geometries of conductors and insulator materials and high thermal conductivity, while offering maximum reliability.

Thin-film technology is impressive in terms of the usability, for example, of ceramic or quartz glass as a substrate material, and the high structural fidelity that can be achieved with tolerances up to ± 2 μm for the track width. Cable lines in thick-film technology are installed in the screen printing process and then burned in. The use of ceramic as a substrate ensures maximum reliability even under the hardest environmental conditions. A thick-film circuit is far better than a standard printed circuit board in terms of temperature resistance and life cycle.

Portfolio

• Rigid Thin-film substrates
• Flexible Thin-film substrates
• Thick-film substrates

The Cicor Group is an international electronics service provider with a wide range of products and services in the fields of printed circuit board assembly, box building and system assembly, control cabinet construction, cable assembly, tool design and fabrication as well as plastic injection molding.. Cicor offers outsourcing solutions for the development
and manufacture of electronic assemblies and complete devices and systems.

As a globally active company with EMS production sites in Switzerland, Germany, Romania and Asia (Singapore, Vietnam, Indonesia, China), the Group exploits synergies and offers solutions based on many years of know-how.

Portfolio

• Engineering services
• Printed circuit board assembly (PCBA)
• Microelectronic assembly
• Test engineering
• Tool design and fabrication
• Plastic injection molding
• Box building and system assembly