Rego Electronics Inc.

Key features:
- Excellent high speed signal transmission capability
- Compliant with DP1.4 Specification
- Lowest Profile ( 22.6mm above PCB )
- Pin through hole solder tails for rugged fixing on PCB
- Tape & reel packaging for automatic pick & place and reflow soldering
- Compliant with RoHS 2.0 & halogen free

Application:
- Industrial computing
- Digital signage
- Docking device
- KVM switches

Is usually used to resolve the heat source that is mostly no greater than 30W.  We not only change the way in material, but also the fin shape and aspect ratio to increase convective or contact area depending on the customer’s designs, such as low profile, high heat flux, greater pin density, robust construction or fast-paced support that could be satisfied and solved effectively.
 

Rego specializes in tailor made thermal module business. We take advantage of diversified heat sink technologies such as extrusion, skive, forge, stamp, die casting & CNC machining. According to different need of each project, our design engineers will integrate heat pipes, vapor chambers, cooling fans into a tailor made thermal module. would you like to know more details? Our engineers and account managers will give you the full picture about the advantage of customized solutions as follows:

- Space saving
- Matching your product design instead of the other way around
- Fulfilling the special requirements of your application
- Total cost-efficient
- Communication and logistics services taylored to your needs

Recently we have been working with many of our valued customers and have completed the qualification test of the CPU cooler for AMD Ryzen™ Embedded V1000 FP5 processor family in many computer industrial applications. Please refer to below information.

- AMD FP5 Processor 
The AMD Ryzen™ Embedded V1000 processor family brings together the breakthrough performance of the pioneering AMD “Zen” CPU and “Vega” GPU architectures in a seamlessly integrated SOC solution that sets a new standard in processing power for next-generation embedded designs. Delivering superior graphics and multimedia processing, and compute performance up to 3.6 TFLOPS with thermal design power (TDP) as low as 12W and as high as 54W, AMD Ryzen™ Embedded V1000 SOCs equip system designers to achieve new levels of processing efficiency and design versatility. With a comprehensive set of advanced, integrated security features, AMD Ryzen™ Embedded V1000 SOCs enable sophisticated system protections complemented by an expansive breadth of I/O interconnect options. 

- Rego Cooler Specification 
RG1100B-EAC(H23)-EF5173-28 ( Three positions connector )
RG1100B-EAC(H23)-EF5174-28 ( Four positions connector – PWM Control )
Outline Dimension : 60 x 60 x 33mm
Heat Sink : Extruded AL6063+C1100, ø60 x 22.6mm
Fan : 50 x 50 x 10 mm, dual ball bearing 
Connector Type : 3 way / 4 way (PWM Control)
Thermal Resistance : 0.61 ℃/W

RG1100B-EAC(H23)-AD5273-28 ( Three positions connector )
RG1100B-EAC(H23)-AD5274-28 ( Four positions connector – PWM Control )
Outline Dimension : 60 x 60 x 43mm
Heat Sink : Extruded AL6063+C1100, ø60 x 22.6mm
Fan : 50 x 50 x 20 mm, dual ball bearing 
Connector Type : 3 way / 4 way (PWM Control)
Thermal Resistance : 0.57 ℃/W

As your reliable thermal solution provider, we always pursue the better ways to resolve your headache from heat issues properly and smoothly. 
It's pleased to introduce you another solution that perfectly not only resolve your heat issues in those designs with space limitation, but also keep your product small and light still! 

FEATURES & BENEFITS
- Ultra slim as 0.076mm thickness
- Conductivity in Planarity: 500 W/mK
- Better heat spreads than 400% to copper and 700% to aluminum
- 80% lighter than Copper and 30% than Aluminum
- Weight Saving compared to metal alternatives
- Eliminates hot spots and protects temperature-sensitive components
- Anisotropic ratio up to 300:1

Target market: 
Flat Display/ Automotive/ Power Electronics/ Handheld devices (Smart Phone/ Tablet/ Wearable...etc)