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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2019

DDR3

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High speed and capacity 
Up to 8Gb DDR3 SDRAM stacks are available in a variety of temperature ranges with x4, x8 and x16 organization

Key Features:

  • High Density – Enable today the next generation of Memory density
  • Wide Data bus x4, x8 or x16
  • Small form factor and low profile
  • High reliability
  • Extended/Specific temperature range
  • Jedec compliant footprint
  • Scalable pitch following customer specification
  • Lead free or SnPb solderballs
  • Cost optimized supply chain


Family / Part Number / Description

  • DDR3 4G083D3D4G08WB23312-stacked 2Gbits x8 memories - FBGA78 (pitch 0,8mm)
  • DDR3 4G163D3D4G16WB23322-stacked 2Gbits x16 memories - FBGA96 (pitch 0,8mm)
  • DDR3 8G043D3D8G04WB23342-stacked 2x2Gbits x4 memories - FBGA78 (pitch 0,8mm)
  • DDR3 8G083D3D8G08WB23352-stacked 2x2Gbits x8 memories - FBGA78 (pitch 0,8mm)

µSSD

LOGO_µSSD

DDR2

LOGO_DDR2

Fusio-II

LOGO_Fusio-II

NAND Flash

LOGO_NAND Flash
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