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26 - 28 February 2019 // Nuremberg, Germany

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Exhibitors & Products embedded world 2019

DDR2

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DDR2 Up to 8Gb in BGA package

Up to 8Gb DDR2 SDRAM stacks are available in a variety of temperature ranges with x4, x8 and x16 organizations

Key Features:
  • High Density – Enable today the next generation of Memory density,
  • Wide Data bus x4, x8 or x16,
  • Small form factor and low profile,
  • High reliability,
  • Extended/Specific temperature range,
  • Jedec compliant footprint,
  • Scalable pitch following customer specification,
  • Lead free or SnPb solderballs,
  • Cost optimized supply chain

Family / Part Number / Description

  • DDR2 2G043D2D2G04UB23252-stacked 1Gbits x4 memories - FBGA63 (pitch 0,8mm)
  • DDR2 2G083D2D2G08UB23272-stacked 1Gbits x8 memories - FBGA63 (pitch 0,8mm)
  • DDR2 4G043D3D4G04UB23232-stacked 2Gbits x4 memories - FBGA63 (pitch 0,8mm)
  • DDR2 4G083D2D4G08UB23022-stacked 2Gbits x8 memories - FBGA63 (pitch 0,8mm)
  • DDR2 4G163D2D4G16UB23032-stacked 2Gbits x16 memories - FBGA87 (pitch 0,8mm)
  • DDR2 8G043D2D8G04UB23212-stacked 2x2Gbits x4 memories - FBGA65 (pitch 0,8mm)
  • DDR2 8G083D2D8G08UB23222-stacked 2x2Gbits x8 memories - FBGA65 (pitch 0,8mm)

µSSD

LOGO_µSSD

DDR3

LOGO_DDR3

Fusio-II

LOGO_Fusio-II

NAND Flash

LOGO_NAND Flash
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