This website uses cookies to make the content more user-friendly and effective. By using this website, you agree to the use of cookies. You can find additonal information about the use of cookies and the possibility of objecting to the use of cookies here.

25 - 27 February 2020 // Nuremberg, Germany

Posting print layout

What information should be shown in the print layout?

Create print layout
Exhibitors & Products embedded world 2019
Zoom product LOGO_Failure & Technology Analysis

Failure & Technology Analysis

LOGO_Failure & Technology Analysis

Failure & Technology Analysis

Request information Request information

Contact us

Please enter your personal information and desired appointment. You can also leave us a message.

Your personal information

Your message for us

Desired appointment during the exhibition

* Compulsory fields you must fill in.

Information on data protection can be found here.

Send
Your message has been sent.

You do not have a registration yet? Register now and use all advantages of the Exhibitors and Products Database, the supporting programme and the TicketShop.

An error has occurred.

RoodMicrotec’s extensively equipped failure & technology analysis laboratory is capable of supporting customers with sophisticated failure analysis, construction and qualification-related analysis. We offer analyses of wafers, integrated circuits, discrete/optoelectronic/electromechanical components, printed circuit boards and complete printed circuit board assemblies. Our highly qualified experts provide full advisory and consulting advice by not only giving a full root cause analysis, but also provide recommendations for corrective actions.

Our optoelectronics team offers comprehensive qualification of LEDs, laser diodes, photodiodes and more. We help to analyse the failure precisely and define suitable measures.

We are experts for the following procedures: 

Non-destructive testing
- X-ray microscopy 
- X-ray computed tomography
- Scanning acoustic microscopy 
- Visual control and whisker inspection

Materials analysis
- Metallography
- Measurement of ionic contamination 
- Scanning Electron Microscopy (SEM) and EDX spectroscopy 
- Dye penetration inspection

Services related to ICs
- Technological analysis
- Failure analysis
- Destructive Physical Analysis (DPA)
- FIB circuit editing
- Authenticity verification

Further services
- Particle Impact Noise Detection (PIND)
- ESD certification
- Leak tests
- Plastics testing (i.e. melt index tests, stress cracking corrosion, thermal melting method) 

For more information, please visit www.roodmicrotec.com/en/services/failure-and-technology-analysis

top

The selected entry has been placed in your favourites!

If you register you can save your favourites permanently and access all entries even when underway – via laptop or tablet.

You can register an account here to save your settings in the Exhibitors and Products Database and as well as in the Supporting Programme.The registration is not for the TicketShop and ExhibitorShop.

Register now

Your advantages at a glance:

  • Advantage Save your favourites permanently. Use the instant access – mobile too, anytime and anywhere – incl. memo function.
  • Advantage The optional newsletter gives you regular up-to-date information about new exhibitors and products – matched to your interests.
  • Advantage Call up your favourites mobile too! Simply log in and access them at anytime.