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25 - 27 February 2020 // Nuremberg, Germany

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Exhibitors & Products embedded world 2019
Zoom product LOGO_Failure & Technology Analysis

Failure & Technology Analysis

LOGO_Failure & Technology Analysis

Failure & Technology Analysis

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RoodMicrotec’s extensively equipped failure & technology analysis laboratory is capable of supporting customers with sophisticated failure analysis, construction and qualification-related analysis. We offer analyses of wafers, integrated circuits, discrete/optoelectronic/electromechanical components, printed circuit boards and complete printed circuit board assemblies. Our highly qualified experts provide full advisory and consulting advice by not only giving a full root cause analysis, but also provide recommendations for corrective actions.

Our optoelectronics team offers comprehensive qualification of LEDs, laser diodes, photodiodes and more. We help to analyse the failure precisely and define suitable measures.

We are experts for the following procedures: 

Non-destructive testing
- X-ray microscopy 
- X-ray computed tomography
- Scanning acoustic microscopy 
- Visual control and whisker inspection

Materials analysis
- Metallography
- Measurement of ionic contamination 
- Scanning Electron Microscopy (SEM) and EDX spectroscopy 
- Dye penetration inspection

Services related to ICs
- Technological analysis
- Failure analysis
- Destructive Physical Analysis (DPA)
- FIB circuit editing
- Authenticity verification

Further services
- Particle Impact Noise Detection (PIND)
- ESD certification
- Leak tests
- Plastics testing (i.e. melt index tests, stress cracking corrosion, thermal melting method) 

For more information, please visit


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