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25 - 27 February 2020 // Nuremberg, Germany

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Exhibitors & Products embedded world 2019
Zoom product LOGO_Wafer & Component Testing

Wafer & Component Testing

LOGO_Wafer & Component Testing

Wafer & Component Testing

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RoodMicrotec has extensive experience in semiconductor testing. We provide all testing services required for discrete components and integrated circuits, from wafer test, through qualification testing, to the final test of semiconductor components.

Our services include:

Test Engineering:
RoodMicrotec’s Test Engineering team provides a complete test solution for a wide variety of components ranging from digital, analogue, mixed-signal to RF ICs. Our highly skilled engineers develop individual test programs for optimal and efficient testing. We develop probe cards and load boards for characterization, production and qualification to the highest standards as required by the automotive and highly-reliability sectors. We also offer test solutions for optoelectronic components such as image sensors, photodiodes and Opto-/Photonic-ASICs and LEDs.
Our services include:

  • Development of test software and hardware for Automatic Test Equipment (ATE)
  • Correlation & characterization
  • Test program conversion
  • Test data evaluation, modification and optimisation of test solutions
  • Development of electrical test for qualification and failure analysis


Test Operations:
RoodMicrotec’s in-house test floor in Nördlingen performs services for component and wafer testing, device programming, scanning and straightening and tape & reel of components. Our test floor operates in clean room conditions of class 6 (1000 particles/cubic feet).
Our services include:

  • Wafer testing up to 12inch at -40ºC up to 150ºC
  • Final test of components in all industry standard package outlines, at full temperature range
  • Scanning, straightening and tape & reel
  • Image sensor / opto ASIC testing
  • Device programming

For more information, please visit www.roodmicrotec.com/en/services/wafer-and-device-testing

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